LIDAR Chip Ridge Waveguide Signal Quality

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Solution Overview

Problem

Current LIDAR chip technologies face limitations in integrating full optical LIDAR functionality due to signal degradation issues, which restrict the amount of optical power that can be transmitted, affecting the sensitivity and effectiveness of the device in applications like ADAS and AR.

Innovation Solution

A LIDAR chip design featuring ridge waveguides with specific dimensions and optical components such as utility and data branches, optical attenuators, and light sensors to control and monitor the LIDAR signal, enabling increased optical power transmission and sensitivity while maintaining a single-mode configuration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If waveguide dimensions are increased to reduce signal degradation, then optical power transmission is improved, but device integration density deteriorates

Engineering Contradiction:
Improvesignal qualityVSAvoidchip area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent changes the dimensional parameters of the waveguide structure by introducing ridge waveguides with specific width (1-4 μm) and height (1-4 μm) ratios, and controlling slab region thickness (0.5-3 μm). This parameter optimization allows the waveguide to maintain single-mode operation while reducing signal degradation, thus improving reliability without requiring excessive chip area.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs composite material structures including silicon-on-insulator substrates with specific layer compositions. The combination of different materials with complementary optical properties enables the waveguide to achieve both low signal degradation and compact footprint by optimizing light confinement and reduction of scattering losses at interfaces.

Inventive Principle:
Principle #40Composite materials

2Reliability

If ridge dimensions are increased to reduce signal degradation, then optical power transmission is improved, but manufacturing precision requirements worsen

Engineering Contradiction:
Improvesignal qualityVSAvoidridge dimension control
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent specifies optimized parameter ranges for ridge width (1-4 μm) and height (1-4 μm) that balance signal quality improvement with manufacturability. These parameter choices represent a compromise point where the benefits of reduced signal degradation are achieved while remaining within practical fabrication capabilities for standard semiconductor manufacturing processes.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The enhanced LIDAR chip achieves improved sensitivity and effectiveness by increasing the waveguide dimensions, allowing for successful application in LIDAR systems, with increased power transmission and reduced signal degradation, enabling more accurate distance and velocity measurements.

Implementation Method 1

one or more ridge waveguides having a ridge of a light-transmitting medium extending away from slab regions of the light-transmitting medium

Methodology Applied
Scientific EffectTotal internal reflection: Total Internal Reflection

Implementation Method 2

a control light sensor that receives a light signal that includes light from the removed portion of the outgoing LIDAR signal

Methodology Applied
Scientific EffectPhotoelectric effect: Photoelectric Effect

Data Source

PatentUS11531090B2Optical sensor chip
Publication Date: 2022.12.20 SILC TECHNOLOGIES INC
  • US11531090B2 patent drawing
  • US11531090B2 patent drawing
  • US11531090B2 patent drawing

AI summary

The LIDAR chip includes a utility waveguide that guides an outgoing LIDAR signal to a facet through which the outgoing LIDAR signal exits from the chip. The chip also includes a control branch that removes a portion of the outgoing LIDAR signal from the utility waveguide. The control branch includes a control light sensor that receives a light signal that includes light from the removed portion of the outgoing LIDAR signal. The chip also includes a data branch that removes a second portion of the outgoing LIDAR signal from the utility waveguide. The data branch includes a light-combining component that combines a reference light signal that includes light from the second portion of the outgoing LIDAR signal with a comparative light signal that includes light that was reflected off an object located off of the chip.