LiDAR Circuit Package Dynamic Airflow Cooling
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Solution Overview
Problem
Current vehicle sensors face limitations in cooling capabilities, particularly in small form factors, which restrict the integration of high-sensitivity circuitry sensitive to operating temperatures, leading to compromised detection performance and size constraints.
Innovation Solution
A LiDAR system with a circuit package that employs dynamic cooling by separating circuits with an airflow pathway and using access switches to divert airflow, allowing for optimal convective cooling and maintaining peak performance operating temperatures in a reduced physical form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If circuit packages are reduced in physical size for vehicle sensors, then sensor compactness and integration are improved, but cooling capabilities deteriorate, limiting the use of temperature-sensitive high-performance circuitry
Solution Approach 1:
The circuit package is segmented into multiple circuit boards (first circuit board, second circuit board) arranged in a stacked configuration with airflow pathways between them. This segmentation allows dedicated cooling channels to be integrated between circuits, enabling effective thermal management in a compact volume without compromising cooling capability.
Solution Approach 2:
The patent transitions from planar circuit arrangement to a three-dimensional stacked configuration with vertical airflow pathways. By utilizing the vertical dimension and creating layered circuit boards with interstitial cooling channels, the design achieves both compact footprint and adequate cooling surface area through spatial optimization.
2Temperature
If access switches are used to dynamically divert airflow for optimal cooling, then temperature control precision is improved, but device complexity increases
Solution Approach 1:
Access switches are implemented to dynamically redirect airflow between different circuit boards based on real-time thermal conditions. These switches enable the cooling system to adapt its airflow distribution, directing more cooling capacity to circuits that require it while reducing airflow to circuits operating within acceptable temperature ranges, thereby achieving precise temperature control.
Solution Approach 2:
The access switches are configured to automatically respond to temperature conditions without requiring external control systems. The cooling mechanism serves itself by using temperature-sensitive elements or sensors integrated into the circuit boards that trigger airflow redirection based on local thermal conditions, simplifying the overall control architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dynamic cooling mechanism enables the integration of temperature-sensitive circuitry in a small form factor, enhancing detection accuracy and autonomy while reducing sensor size, allowing for efficient heat management and prolonged peak performance.
Implementation Method 1
An access switch may be positioned in the airflow pathway and configured to divert airflow around the first circuit and toward the second circuit via the airflow pathway
Data Source
AI summary
Systems, methods, and other embodiments described herein relate to cooling a circuit package. In one embodiment, a light detection and ranging system has a first circuit separated from a second circuit by an airflow pathway. An access mechanism may be positioned in the airflow pathway and configured to divert airflow around the first circuit and toward the second circuit via the airflow pathway until a package condition is encountered that triggers the access switch to a second cooling position allowing airflow to flow to the airflow pathway unimpeded.