LiDAR Heatsink and Shielding Layout for Dustproof Thermal Control
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Solution Overview
Problem
LiDAR devices in autonomous vehicles face issues with waterproofing, dustproofing, and heat dissipation, leading to reduced accuracy and performance due to exposure to external elements and heat generation by electronic components.
Innovation Solution
A LiDAR device design featuring a case with a shielding member, a heatsink structure with protrusion portions and adhesive members for improved waterproofing and dustproofing, and efficient heat dissipation through a heatsink and heat dissipation fins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If LiDAR devices are installed in the interior space of the vehicle, then they can be easily exposed to external dust or moisture, but providing sufficient accommodating space in the internal space is difficult
Solution Approach 1:
The patent implements nesting by placing the heatsink inside the accommodating space formed between the light receiving module and the main substrate. The shielding member is positioned within the case structure, and the entire thermal management system is nested within the compact LiDAR housing, maximizing space utilization while maintaining waterproof and dustproof capabilities.
Solution Approach 2:
The patent extends the accommodating space in the thickness direction (vertical dimension) rather than expanding the horizontal footprint. By utilizing the Z-axis space between optical components and the main substrate, the design provides sufficient room for the heatsink and shielding member without increasing the overall footprint of the LiDAR device.
2Adaptability or versatility
If various electronic components are installed in the LiDAR device, then functionality is improved, but heat generation increases causing performance deterioration
Solution Approach 1:
The patent introduces the heatsink as an intermediary thermal management component between the light receiving module and the main substrate. This mediator component conducts heat away from sensitive electronic components, preventing temperature buildup that would otherwise degrade performance while allowing full functional capability to be maintained.
Solution Approach 2:
The patent extracts heat from the system by removing thermal energy from the electronic components through the heatsink structure. By taking out the harmful thermal byproduct, the device can maintain higher functionality without performance deterioration from excessive heat generation.
3Ease of manufacture
If the shielding member is disposed below the heatsink, then assembly is simplified, but waterproof and dustproof functions are reduced
Solution Approach 1:
The patent applies preliminary action by pre-positioning the shielding member above the heatsink during the design phase to ensure optimal waterproof and dustproof protection. This predetermined arrangement ensures that the shielding member effectively blocks contaminants before they can reach sensitive components, while still maintaining reasonable assembly procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances waterproof and dustproof capabilities while effectively dissipating heat, maintaining the LiDAR device's performance and accuracy by preventing external contaminants and ensuring efficient thermal management.
Implementation Method 1
a heatsink disposed between the light receiving module and the main substrate and between the light emitting module and the main substrate
Implementation Method 2
a shielding member disposed between a coupling surface of the first case and the second case
Data Source
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AI summary
The lidar device according to the embodiment may include a case, a light receiving module disposed inside the case, a light emitting module disposed inside the case and spaced apart from the light receiving module in a first direction, a main substrate disposed below the light receiving module and the light emitting module and electrically connected to the light receiving module and the light emitting module and a heatsink disposed between the light receiving module and the main substrate and between the light emitting module and the main substrate.