LiDAR Laser Driver Module Layout With Low-Inductance Coupling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing LIDAR systems face challenges in generating precise, high-intensity light pulses due to parasitic inductances in the switching loop, which affect the duration and control of current pulses, especially when driving multiple LASER diodes in arrays, and current technologies for integrating LASER diodes on PCBs are not optimal.
Innovation Solution
An electronic module design featuring an interface card with a recess to house a lighting module, where the driver module is directly connected to the lighting module without wire bonding, using conductive adhesive and solder paste for electrical coupling, reducing parasitic inductances and minimizing mechanical and thermal stresses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional PCB integration methods with wire bonding are used, then mechanical flexibility is improved, but parasitic inductance increases
Solution Approach 1:
The patent merges the wire bonding function with the PCB trace structure by creating conductive traces that extend from the PCB surface and directly contact the laser diode terminals. This eliminates the need for separate wire bonding steps while achieving lower parasitic inductance through optimized trace geometry and direct electrical contact paths.
Solution Approach 2:
The patent extracts the wire bonding function from the traditional assembly process and replaces it with integrated PCB conductive traces. By removing the wire bonding step entirely and using PCB-fabricated traces instead, the solution reduces parasitic inductance while simplifying the overall connection structure.
2Use of energy by moving object
If capacitor size is increased to store more energy, then pulse energy is improved, but switching loop length increases
Solution Approach 1:
The patent transitions from planar capacitor placement to three-dimensional vertical stacking by mounting the capacitor upright on the PCB with its terminals extending vertically. This allows the capacitor to be positioned closer to the laser diode in the vertical dimension while maintaining adequate energy storage capacity, thereby reducing the horizontal switching loop length.
Solution Approach 2:
The patent introduces a capacitor mount structure as an intermediary component that provides both mechanical support and optimized electrical connectivity. The mount positions the capacitor optimally in space and provides low-inductance connection paths to the laser diode, mediating between the energy storage requirement and the compact loop length requirement.
3Measurement precision
If rise and fall times are reduced for precise pulse control, then measurement precision is improved, but di/dt requirements increase
Solution Approach 1:
The patent changes the electrical parameters of the switching loop by optimizing trace geometry, reducing loop area, and selecting low-inductance connection methods. These parameter changes enable faster current rise and fall times by reducing the inductive reactance that limits di/dt, thereby achieving both precise pulse control and high measurement accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates fast switching with rise and fall times of 100 ps or less, enabling controlled pulses with amplitudes of tens of amps, compatible with standard assembly processes and reducing parasitic inductances.
Implementation Method 1
using conductive adhesive and solder paste for electrical coupling, reducing parasitic inductances
Data Source
AI summary
An electronic module for generating light pulses includes an electronic card or interposer, a LASER-diode lighting module, and a LASER-diode driver module. The interposer has an edge recess in which the lighting module is completely inserted. The driver module is arranged on top of the interposer and the lighting module. The electrical connections for driving the LASER diodes are obtained without resorting to wire bonding in order to reduce the parasitic inductances.