On-Chip LiDAR Micromirror Transmitter for Compact Optical Assembly
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Solution Overview
Problem
Existing Lidar systems face challenges with large module sizes and high assembly requirements due to discrete components in the emitting end, hindering cost reduction and integration efficiency.
Innovation Solution
Integration of laser scanning components, including a scanning micromirror chip, packaging shell, and packaging components on a single chip, with optical path redirection and precise positioning to reduce size and complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If discrete components (lasers, optical lenses, MEMS micromirrors) are used in the emitting end, then each component can be independently manufactured and assembled, but the module size becomes large and assembly requirements become high
Solution Approach 1:
The patent integrates the laser, optical lens, and MEMS micromirror into a single chip structure. The laser and optical lens are formed on the same substrate as the MEMS micromirror, eliminating the need for separate assembly of these discrete components. This merging approach reduces assembly complexity while maintaining the functional independence of each component through precise on-chip integration.
2Ease of repair
If discrete components are used in the emitting end, then component replacement and maintenance are simplified, but the module size becomes large
Solution Approach 1:
By integrating multiple components onto a single chip, the patent reduces the overall module size while maintaining the ability to replace entire integrated modules. The compact integrated design allows for smaller form factor without sacrificing maintainability, as the integrated module itself can be replaced as a unit.
Solution Approach 2:
The patent transitions from a three-dimensional assembly of discrete components to a two-dimensional integrated circuit layout. By arranging the laser, optical lens, and MEMS micromirror in a planar configuration on the chip, the module size is significantly reduced while maintaining all necessary functional interfaces for replacement and maintenance.
3Adaptability or versatility
If discrete components are used, then each component can be optimized independently, but costs reduction becomes difficult
Solution Approach 1:
The integration of multiple components into a single chip enables economies of scale in manufacturing. By producing all components on the same substrate using compatible fabrication processes, the patent reduces per-unit costs through batch processing and eliminates the need for multiple separate assembly operations, thereby achieving cost reduction while maintaining component optimization capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves high-precision optical integration, reduces chip size and costs, and simplifies assembly by eliminating the need for separate packaging and control of laser and scanning micromirror components.
Implementation Method 1
The packaging component is configured to: collimate and reflect a beam emitted by the laser
Implementation Method 2
The packaging component is configured to: collimate and reflect a beam emitted by the laser
Data Source
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Figure 2
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AI summary
Embodiments of this application provide a laser scanning apparatus, which is a key component of a Lidar and may be used in fields such as autonomous driving and intelligent driving. The scanning apparatus includes: a scanning micromirror chip, a packaging shell, and a packaging component. The scanning micromirror chip includes a scanning micromirror and a laser, where the scanning micromirror and the laser are integrated at different positions of the scanning micromirror chip. The packaging shell is located on the scanning micromirror chip, and forms a hollow structure together with the scanning micromirror chip. Both the laser and the packaging component are located in the hollow structure. In addition, the packaging component is fixed on the packaging shell, and is configured to collimate and reflect the beam emitted by the laser, and emit output light to the scanning micromirror. All transmit end components of the laser scanning apparatus are integrated on a same chip, and locations of the components are fixed in advance, so that a volume of a transmit end can be reduced, and difficulty in assembly and subsequent maintenance can be reduced.