Wafer-Level LIDAR Optics With Microlens-Notch Light Control
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Solution Overview
Problem
The manufacturing of semiconductor optical devices for LIDAR systems is inefficient, leading to increased costs and reduced system performance due to light loss and interference from back-reflection in existing LIDAR systems.
Innovation Solution
A method involving the formation of microlens and notch structures on semiconductor wafers using dry-etch and wet-etch processes, followed by bonding and dicing to create individual optical devices, with anti-reflective and metal coatings applied to minimize light loss and interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional manufacturing methods are used for semiconductor optical devices, then manufacturing flexibility is maintained, but manufacturing efficiency is low and production time is long
Solution Approach 1:
The patent combines multiple manufacturing operations (forming microlens structures, forming notch structures, bonding wafers, and dicing) into an integrated wafer-level processing sequence. By performing these operations on full wafers before dicing into individual devices, the method eliminates repeated setup and handling steps, thereby improving manufacturing efficiency while managing process complexity through systematic integration.
2Loss of energy
If existing LIDAR system components are used, then system assembly is straightforward, but light loss and back-reflection interference occur
Solution Approach 1:
The patent applies local quality by creating microlens structures and notch structures at specific locations on the semiconductor wafer surface. The microlens structures are formed at first locations to focus and direct light, while notch structures are formed at second locations (opposite the first locations) to prevent back-reflection. This spatial differentiation of structural properties optimizes light management locally across different regions of the optical device.
Solution Approach 2:
The patent converts the potentially harmful effect of back-reflection into a beneficial feature by designing notch structures that strategically reflect light away from sensitive components. The notches are positioned and shaped to redirect back-reflected light in controlled directions, transforming what would be interference into a useful light management mechanism that protects the system from harmful reflections.
3Device complexity
If multiple separate components are used in LIDAR systems, then component functionality is specialized, but the number of parts increases and system performance decreases
Solution Approach 1:
The patent merges multiple optical functions (light focusing via microlenses, light direction via notches, and structural support) into a single integrated semiconductor optical device formed on a wafer. This consolidation reduces the total number of discrete components in the LIDAR system while maintaining all necessary functionalities, thereby improving reliability by reducing connection points and potential failure modes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the manufacturing efficiency and reduces light loss by strategically directing light, improving the overall performance and reducing the number of components in LIDAR systems.
Implementation Method 1
a first microlens structure configured to receive a first beam... a second microlens structure coupled to the second notch structure, the second microlens structure configured to receive the second beam reflected by the second notch structure
Implementation Method 2
a first notch structure coupled to the first microlens structure. The first notch structure is configured to receive the first beam and direct the first beam into an environment of a vehicle... a second notch structure configured to receive a second beam from the environment of the vehicle, and a second microlens structure coupled to the second notch structure. The second microlens structure is configured to receive the second beam reflected by the second notch structure
Data Source
AI summary
A method for manufacturing a semiconductor optical device for a LIDAR sensor system for a vehicle includes (a) forming a plurality of microlens structures at respective first locations on a first major surface of respective first and second semiconductor wafers. The method includes (b) forming a plurality of notch structures at respective second locations on a second major surface of the respective first and second semiconductor wafers, wherein the respective second locations on the second major surface are substantially opposite the respective first locations on the first major surface. The method includes (c) bonding the second major surface of the first semiconductor wafer to the second major surface of the second semiconductor wafer to form a semiconductor wafer pair. The method includes (d) dicing the semiconductor wafer pair to segment the semiconductor wafer pair into a plurality of individual semiconductor optical devices.