Wafer-Bonded LIDAR Optics With Microlens and Notch Alignment
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Solution Overview
Problem
Existing manufacturing processes for semiconductor optical devices in LIDAR systems are inefficient and costly, limiting the scalability and efficiency of LIDAR systems in applications such as autonomous vehicles and robotic platforms.
Innovation Solution
A method involving the formation of microlens and notch structures on semiconductor wafers using dry- and wet-etch processes, followed by bonding and dicing to create integrated optical devices, with strategic coatings to enhance light direction and reduce interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional manufacturing processes are used for semiconductor optical devices, then manufacturing precision can be maintained, but manufacturing time and cost increase significantly
Solution Approach 1:
The patent combines multiple separate manufacturing operations into a single integrated wafer-level bonding process. Multiple optical components are fabricated and bonded together on the wafer scale before dicing, merging what would traditionally be separate device-level assembly steps into one coordinated wafer-level operation, thereby reducing total manufacturing time and improving efficiency
2Productivity
If wafer-level manufacturing is implemented, then productivity and cost-effectiveness improve, but process complexity increases
Solution Approach 1:
The manufacturing process is segmented into distinct wafer-level operations: forming microlens structures on first wafers, forming notch structures on second wafers, bonding corresponding structures together, and finally dicing into individual devices. This segmentation allows each sub-process to be optimized independently while maintaining overall wafer-level efficiency, managing complexity through structured decomposition
3Manufacturing precision
If microlens and notch structures are formed with precise alignment, then optical performance improves, but manufacturing difficulty increases
Solution Approach 1:
Alignment features and reference structures are incorporated into the wafer fabrication process before bonding occurs. The microlens and notch structures are pre-formed with built-in alignment references that guide the bonding process, ensuring precise optical alignment is achieved through the preliminary structuring of the wafers rather than through complex post-fabrication adjustment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing time and cost, enhances light channeling efficiency, and minimizes light loss, thereby improving the performance and scalability of LIDAR systems.
Implementation Method 1
The plurality of microlens structures may be formed at the respective first locations using a dry-etch process (e.g., reactive-ion etching)
Implementation Method 2
The plurality of notch structures may be formed at the respective second locations using a wet-etch process (e.g., anisotropic Silicon etching)
Implementation Method 3
bonding the second major surface of the first semiconductor wafer to the second major surface of the second semiconductor wafer to form a semiconductor wafer pair
Data Source
AI summary
A semiconductor optical device for a LIDAR sensor system for a vehicle includes a first portion and a second portion bonded to the first portion. The first portion includes a first microlens structure configured to receive a first beam. The first portion also includes a first notch structure coupled to the first microlens structure, the first notch structure configured to receive the first beam and direct the first beam into an environment of the vehicle. The second portion includes a second notch structure surface configured to receive a second beam from the environment of the vehicle. The second portion also includes a second microlens structure coupled to the second notch structure, the second microlens structure configured to receive the second beam reflected by the second notch surface and direct the second beam to a receiver.