Lidar Sensing Chip Substrate for Heat Dissipation and CTE Matching
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Solution Overview
Problem
The increasing power consumption of lidar receiving modules due to improved object recognition precision and angular resolution leads to heat dissipation issues and chip stress caused by inconsistent thermal expansion coefficients between the sensing chip and the PCB.
Innovation Solution
An integrated apparatus with a substrate layer having a small coefficient of thermal expansion difference with the sensing chip, allowing for efficient heat dissipation and consistent deformation, featuring a substrate layer with materials like aluminum silicon carbide, copper, or wolfram, and a lens structure with matched thermal expansion to maintain focus on the photosensitive surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the power consumption of the receiving module is increased to improve object recognition precision and angular resolution, then the measurement precision is improved, but the heat dissipation problem worsens
Solution Approach 1:
A heat dissipation substrate is introduced as an intermediary component between the sensing chip and the PCB. This substrate serves as a thermal conductor to transfer heat away from the sensing chip, while also providing mechanical support and electrical isolation, thus resolving the heat dissipation problem without compromising the improved measurement precision
Solution Approach 2:
The heat dissipation substrate is made of composite materials with specific thermal and mechanical properties, combining materials that provide both excellent heat dissipation capability and matched thermal expansion characteristics, allowing the system to maintain high measurement precision while effectively managing heat generation
2Measurement precision
If the power consumption of the receiving module is increased to improve angular resolution, then the measurement precision is improved, but the chip stress worsens
Solution Approach 1:
The heat dissipation substrate is designed with a coefficient of thermal expansion (CTE) that matches both the sensing chip and the PCB. This CTE matching prevents differential thermal expansion and contraction during temperature changes, eliminating chip stress while allowing the receiving module to operate at higher power levels for improved angular resolution
Solution Approach 2:
The patent changes the thermal and mechanical parameters of the substrate material to achieve optimal CTE matching. By selecting materials with specific thermal conductivity and CTE values, the system can maintain mechanical stability and reduce chip stress under varying operating conditions, enabling higher power consumption for improved measurement precision
3Temperature
If different materials are used for substrate layer and PCB, then the heat dissipation performance is improved, but the deformation consistency worsens
Solution Approach 1:
The heat dissipation substrate has non-uniform material properties: it provides excellent thermal conductivity in the direction of heat flow paths while having matched CTE in the plane of the substrate to maintain deformation consistency with both the sensing chip and PCB. This local differentiation of material properties resolves both the heat dissipation and deformation consistency requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat from the sensing chip, reduces chip stress, and maintains optical performance by ensuring consistent deformation across temperature changes, enhancing the lidar's reliability and efficiency.
Implementation Method 1
The sensing chip is disposed on the substrate layer, so that the sensing chip can quickly dissipate heat by using the substrate layer
Implementation Method 2
A difference between a coefficient of thermal expansion CTE of the substrate layer and a CTE of the sensing chip is less than a first preset threshold... under a same temperature difference, it can be ensured that a deformation amount of the substrate layer is basically consistent with a deformation amount of the sensing chip
Data Source
AI summary
An integrated apparatus, a detection apparatus, a terminal, and a manufacturing method are disclosed, relate to the field of electronic technologies, and are used to resolve problems of heat dissipation and proneness to a chip stress of a sensing chip. The integrated apparatus includes a substrate layer, a sensing chip, and a PCB. The sensing chip is disposed on the substrate layer. The PCB is disposed on the substrate layer, the PCB is provided with an opening, the sensing chip is located in the opening, and the sensing chip is connected to the PCB through a transmission line. A difference between a coefficient of thermal expansion CTE of the substrate layer and a CTE of the sensing chip is less than a first preset threshold.