Sensor Assembly Airflow Duct for LIDAR Heat Dissipation
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Solution Overview
Problem
Autonomous vehicle sensors, particularly LIDAR devices, face challenges in heat dissipation and debris protection, which can affect their accuracy and reliability due to inadequate airflow and exposure to environmental debris.
Innovation Solution
A sensor assembly incorporating a heatsink with vertically oriented fins and an airflow duct that directs airflow across the sensor window, creating an air curtain for both heat dissipation and debris protection, while using a compressor to enhance airflow efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a sensor assembly is exposed to the external environment for detection, then detection capability is improved, but heat dissipation becomes insufficient and debris can damage the sensor window
Solution Approach 1:
The sensor assembly is segmented into distinct functional zones: a sensor window for detection, a heatsink with fins for heat dissipation, and a duct for airflow control. This segmentation allows each component to perform its specific function optimally while working together as an integrated system.
Solution Approach 2:
A duct is introduced as an intermediary component that directs airflow between the heatsink fins and across the sensor window. This intermediary structure enables controlled air flow to simultaneously remove heat from the sensor assembly and create protective airflow patterns.
2Measurement precision
If a sensor assembly is exposed to the external environment for detection, then detection capability is improved, but the sensor window becomes vulnerable to debris impact
Solution Approach 1:
The duct acts as an intermediary that channels airflow to create a protective air curtain across the sensor window. This controlled airflow serves as a protective barrier that reduces debris impact while maintaining detection capability.
Solution Approach 2:
The invention uses pneumatic principles by directing airflow through the duct to create a protective air flow pattern across the sensor window. This pneumatic approach uses air pressure and flow dynamics to reduce debris impact without physical contact.
3Temperature
If heat dissipation structures are added to the sensor assembly, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The duct is designed to serve multiple functions simultaneously: it directs airflow for heat dissipation from the heatsink fins and creates protective airflow across the sensor window. This merging of functions reduces the need for separate components and simplifies the overall assembly.
Solution Approach 2:
The duct structure is designed as a multi-functional component that performs both heat dissipation airflow management and sensor window protection. This universal component approach reduces device complexity by eliminating the need for separate heat dissipation and protection systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively increases heat dissipation capacity and reduces debris impact on the sensor window, enhancing the accuracy and reliability of external environment detection by LIDAR sensors.
Implementation Method 1
a heatsink (90) including a plurality of fins (94)
Implementation Method 2
The duct (104) is positioned to direct airflow between the fins (94) and across the sensor window (84)
Implementation Method 3
The duct (104) is positioned to create an air curtain across the sensor window (84)
Data Source
AI summary
A sensor assembly includes a sensor window, a heatsink including a plurality of fins, and a duct. The heatsink is fixed relative to the sensor window. The duct is positioned to direct airflow between the fins and across the sensor window. The sensor assembly may include a motor and/or a circuit board fixed relative to the sensor window. The heatsink may be directly connected by a thermal conductor to the motor and/or the circuit board.