Lidless Semiconductor Package EMI Absorber Layout
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor packages face challenges in managing electromagnetic interference (EMI) radiation, which degrades the performance of additional components on the substrate, leading to increased error rates and data loss due to the consumption of computing and networking resources.
Innovation Solution
A lidless semiconductor package design that includes a substrate with a semiconductor device, a stiffener plate surrounding the device, and an EMI absorber positioned between the device and the stiffener plate, allowing for effective absorption of EMI radiation without occupying valuable substrate space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a lidless semiconductor package is used to improve thermal performance, then thermal performance is improved, but electromagnetic interference radiation increases
Solution Approach 1:
An electromagnetic interference absorber is introduced as an intermediary component between the semiconductor device and the external environment. The absorber includes a body portion with a main opening that receives the semiconductor device, allowing thermal contact while absorbing EMI radiation. This mediator resolves the contradiction by permitting thermal performance improvement while blocking the harmful electromagnetic radiation.
Solution Approach 2:
The electromagnetic interference absorber is selectively placed in specific locations around the semiconductor device rather than covering the entire package. The body portion with its main opening provides localized EMI absorption where needed, while maintaining open areas for thermal management. This local quality approach allows thermal performance improvement in critical areas while containing EMI radiation in specific zones.
2Adaptability or versatility
If additional components are added to the substrate, then functionality is improved, but susceptibility to electromagnetic interference increases
Solution Approach 1:
The electromagnetic interference absorber serves as a protective intermediary between the additional components on the substrate and the EMI radiation generated by the semiconductor device. The absorber's body portion surrounds and protects vulnerable components while allowing them to maintain their functional positions on the substrate, thus preserving functionality while reducing susceptibility to EMI.
3Object-generated harmful factors
If an electromagnetic interference absorber is added, then EMI radiation is reduced, but substrate space is consumed
Solution Approach 1:
The electromagnetic interference absorber is designed with a body portion that provides EMI absorption only in the specific locations where semiconductor devices and additional components are mounted. The main opening and surrounding structure are positioned to absorb EMI radiation locally around the devices, rather than requiring coverage of the entire substrate. This localized approach reduces the overall substrate space consumed while maintaining effective EMI protection.
Solution Approach 2:
The electromagnetic interference absorber extends in the vertical dimension above the substrate surface, utilizing the third dimension for EMI absorption functionality. The body portion rises from the substrate plane, creating a three-dimensional structure that absorbs EMI radiation in the vertical space around the semiconductor devices without occupying excessive horizontal substrate area. This dimensional transition allows effective EMI protection with minimal substrate space consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces EMI radiation, preventing it from degrading or rendering additional components inoperable, thus conserving computing and networking resources and minimizing error rates and data loss.
Implementation Method 1
an electromagnetic interference absorber configured to be provided between the semiconductor device and the stiffener plate
Data Source
AI summary
A semiconductor package may include a substrate, an application-specific integrated circuit (ASIC) provided on a first portion of a surface of the substrate, a memory device provided on a second portion of the surface of the substrate, and a stiffener plate provided on a third portion of the surface of the substrate. The stiffener plate may be spaced from and may surround the ASIC and the memory device. The semiconductor package may include an electromagnetic interference (EMI) absorber provided on a fourth portion of the surface of the substrate. The EMI absorber may be provided between the stiffener plate and the ASIC and the memory device. The EMI absorber may surround the ASIC and the memory device and may block EMI radiation generated by the ASCI and the memory device.