Laser Induced Extra-Planar Elicitation for 3D Micro-Component Deformation
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Solution Overview
Problem
Existing methods for forming three-dimensional micro- and nano-scale components face limitations, including residual stress issues, material damage, and incompatibility with thin structures, especially when using traditional silicon-based photolithographic techniques and thermal laser processes.
Innovation Solution
Laser Induced Extra-Planar Elicitation (LIEPE) process, where a substrate with a laser-absorbing release layer is used to propel pre-patterned thin film components out of the substrate plane using localized laser energy, avoiding thermal stress and enabling direct, controlled deformation of ductile materials into complex 3D configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If thermal laser forming is used to produce bending deformation in micro-scale components, then deformation capability is improved, but residual stress distributions and material damage occur due to rapid cooling
Solution Approach 1:
The patent replaces thermal laser forming with a non-thermal laser-based process called Laser Peen Forming (LPF). Instead of using thermal means to heat and deform the material, LPF uses laser-induced shockwaves to create controlled residual stress distributions that produce the desired bending deformation without thermal damage
Solution Approach 2:
The patent changes the fundamental parameter of the laser processing method from thermal (heating) to mechanical (shockwave). By using nanosecond pulsed lasers to generate shockwaves rather than continuous thermal heating, the process achieves deformation without the harmful thermal effects of rapid cooling and residual stress
2Object-affected harmful factors
If Laser Peen Forming is used to produce bending deformation in metal thin foils, then thermal processing drawbacks are eliminated, but the process is not suitable for exceedingly thin structures (sub-micron thickness films) as it relies on generating a through-thickness stress gradient which is extremely difficult to accomplish without catastrophically damaging them
Solution Approach 1:
The patent applies local quality by creating highly localized stress gradients only in the region where deformation is needed, rather than attempting to create a through-thickness stress gradient across the entire film. The laser is focused to a specific depth, and the shockwave is confined to a localized region, allowing thin films to be deformed without catastrophic damage
Solution Approach 2:
The patent uses partial action by applying the laser shockwave only to the portion of the film that needs to be deformed, rather than attempting to create a complete through-thickness stress gradient. This localized partial deformation approach allows thin films to be processed without the excessive stress that would cause damage
3Ease of manufacture
If traditional silicon-based photolithographic techniques are used to form three-dimensional micro- and nano-scale components, then manufacturing capability is improved, but inherent limitations including residual stress issues and material damage occur
Solution Approach 1:
The patent replaces traditional silicon-based photolithographic techniques with a laser-based direct writing approach. Instead of using complex multi-step lithographic processes that require photoresists, patterning, and etching, the invention uses laser-induced shockwaves to directly deform and shape the material, eliminating the harmful effects associated with traditional photolithography
Solution Approach 2:
The patent extracts and eliminates the problematic intermediate steps and materials from traditional photolithographic processes. By using direct laser forming, the method removes the need for photoresists, development chemicals, and multiple patterning steps, thereby eliminating the residual stress and material damage associated with these processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
LIEPE allows for the formation of true 3D structures with preserved material properties, avoiding thermal effects and stress-related issues, and is compatible with various thin film materials, enabling flexible and controllable fabrication of micro- and nano-scale components for diverse applications, including opto-electronic and micro-electro-mechanical systems.
Implementation Method 1
A source of laser energy is directed through the substrate and into a portion of the release layer, which vaporizes the portion of the release layer by absorption of the laser energy
Implementation Method 2
vaporizes the portion of the release layer by absorption of the laser energy
Implementation Method 3
Pressure from the vaporization of the release layer deforms the portion of the component away from the substrate
Data Source
AI summary
In a method of controlled laser deformation, a substrate is provided that is transparent to the laser energy. At least a portion of the substrate is coated with a release layer that absorbs the laser energy. A component to be deformed is attached to the release layer opposed to the substrate. A source of laser energy is directed through the substrate and into a portion of the release layer, which vaporizes the portion of the release layer by absorption of the laser energy, and releases a portion of the component from the substrate. This deforms the portion of the component away from the substrate by the vaporization of the release layer such that at least one edge of the component is no longer in contact with the release layer or substrate, and leaving a second portion of the component still attached to non-vaporized release layer.