Semiconductor Processing Chamber With Lift Bases for Faster Wafer Transfer
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Solution Overview
Problem
The existing manipulator in semiconductor processing equipment is inadequate for the multi-chamber structure, leading to inefficiencies in wafer transfer and processing capacity limitations in atomic layer deposition systems.
Innovation Solution
A processing chamber design with a transfer chamber and multiple reaction chambers connected through bottom openings, featuring ascending and descending bases and a transfer mechanism that allows simultaneous wafer transfer and processing, eliminating the need for an external manipulator and optimizing wafer transfer time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a multi-chamber structure is adopted to improve processing capacity, then the processing efficiency is improved, but the existing manipulator cannot satisfy the wafer transfer requirements
Solution Approach 1:
The processing chamber is divided into multiple reaction chambers (first reaction chamber, second reaction chamber, etc.) that can process wafers simultaneously. Each reaction chamber is independently controllable, allowing parallel processing operations while maintaining independence of each processing zone.
Solution Approach 2:
A transfer chamber is introduced as an intermediary space between the reaction chambers and the external environment. This transfer chamber houses a transfer mechanism that coordinates wafer movement between multiple reaction chambers, eliminating the need for the existing manipulator to directly serve multiple chambers and resolving the transfer efficiency bottleneck.
2Productivity
If a multi-chamber structure is adopted, then processing capacity is improved, but the equipment complexity increases
Solution Approach 1:
Multiple reaction chambers are integrated into a single processing system with shared control and transfer mechanisms. The chambers are arranged in a compact configuration and connected through the transfer chamber, allowing multi-chamber functionality while managing structural complexity through unified design.
Solution Approach 2:
The transfer chamber serves multiple functions: it acts as a vacuum barrier, provides a transfer mechanism housing, and enables wafer movement between different reaction chambers. This multi-functionality reduces the need for separate components for each function, thereby managing complexity while achieving multi-chamber processing capacity.
3Loss of time
If simultaneous wafer transfer and processing is implemented, then wafer transfer time is saved, but the device complexity increases
Solution Approach 1:
The transfer mechanism enables continuous wafer transfer operations while reaction chambers simultaneously perform processing. Wafers can be transferred to and from reaction chambers without interrupting the processing cycles, and multiple wafers can be staged in the transfer chamber for sequential loading, eliminating idle transfer time while maintaining continuous processing.
Data Source
AI summary
The present disclosure provides a processing chamber applied to semiconductor processing equipment, including a transfer chamber and a plurality of reaction chambers above the transfer chamber. The plurality of reaction chambers are all communicatively connected to the transfer chamber through bottom openings. A plurality of bases can ascend and descend between the reaction chambers and the transfer chamber. The processing chamber further includes a transfer mechanism and a carrier mechanism arranged in the transfer chamber. The transfer mechanism is configured to transfer wafers from outside the processing chamber to the carrier mechanism or onto the plurality of bases, and to transfer the wafers on the plurality of bases out of the processing chamber. The carrier mechanism is configured to carry the plurality of wafers and can transfer the plurality of wafers carried by the carrier mechanism onto the plurality of bases.