Lift Pin Flared Geometry for TEOS Oxide Film Uniformity

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Solution Overview

Problem

Current lift pin designs in semiconductor processing tools cause high temperature spots (hot spots) on substrates due to inadequate heat dissipation, leading to non-uniform film thickness and reduced deposition rates.

Innovation Solution

The design includes a lift pin assembly with a pin head having a planar top surface and a flared portion angled between 110° to 140° relative to the longitudinal axis, made from materials like aluminum nitride for improved thermal conductivity, and a shoulder with a through-hole for secure positioning, ensuring a reduced distance between the lift pin and substrate to enhance heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the lift pin design is used to support substrate, then substrate transfer is facilitated, but hot spots occur on substrate surface due to inadequate heat dissipation

Engineering Contradiction:

Improvesubstrate transferVSAvoidhot spots on substrate surface

Core Design Contradiction:

Ease of operationVSTemperature

Solution Approach 1:

A thermal management layer is introduced between the lift pin and substrate to mediate heat transfer. This intermediary layer conducts heat away from the substrate surface more effectively, preventing hot spot formation while maintaining the lift pin's substrate support function

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The thermal conductivity parameter of the lift pin assembly is changed by incorporating materials with higher thermal conductivity or modifying the structural parameters to enhance heat dissipation capability, thereby reducing substrate surface temperature at lift pin locations

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration minimizes hot spots on the substrate, improving deposition rates and film uniformity by increasing heat dissipation and reducing mechanical stress during thermal cycling.

Implementation Method 1

made from materials like aluminum nitride for improved thermal conductivity, and a shoulder with a through-hole for secure positioning, ensuring a reduced distance between the lift pin and substrate to enhance heat dissipation

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11508611B2Enhanced lift pin design to eliminate local thickness non-uniformity in teos oxide films

Publication Date: 2022.11.22 APPLIED MATERIALS INC

AI summary

Implementations disclosed herein generally provide a lift pin that can improve the deposition rate and uniform film thickness above lift pin areas. In one implementation, the lift pin includes a first end coupling to a shaft, the first end having a pin head, and the pin head having a top surface, wherein the top surface is planar and flat, and a second end coupling to the shaft, the second end having a flared portion, wherein the flared portion has an outer surface extended along a direction that is at an angle of about 110° to about 140° with respect to a longitudinal axis of the lift pin.