Lifting Shell Heat Dissipation Channel for Terminal Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional heat dissipation structures in notebook computers are inadequate for managing increasing heat generated by high-performance components, leading to elevated surface temperatures and performance throttling due to underclocking.
Innovation Solution
A housing structure featuring a bottom shell and a lifting shell with a sliding assembly that forms a heat dissipation channel, where a heat dissipation panel contacts heat-emitting components and directs heat into this channel for efficient airflow to the external environment, optionally incorporating heat conducting materials, heat pipes, heat dissipation fins, and fans for enhanced cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipation structures (heat pipe, heat sink, fan) are used, then basic heat dissipation function is provided, but heat dissipation performance is insufficient for high-performance components
Solution Approach 1:
The heat dissipation structure is segmented into multiple functional components: heat dissipation panel, lifting shell, bottom shell, and sliding assembly. This segmentation allows each component to perform its specific function efficiently while maintaining overall system performance.
Solution Approach 2:
The lifting shell is designed to be movable relative to the bottom shell through a sliding assembly, creating a dynamic heat dissipation channel. This dynamic structure can adjust the heat dissipation capacity based on thermal requirements while maintaining a compact form when cooling is not needed.
2Temperature
If heat dissipation channel is always open, then heat dissipation performance is improved, but device volume increases and portability decreases
Solution Approach 1:
The heat dissipation channel is designed as a dynamic structure where the lifting shell can move between positions. When cooling is needed, the channel opens; when not needed, the lifting shell returns to its initial position, closing the channel and maintaining a compact device volume.
Solution Approach 2:
The lifting shell nests within or alongside the bottom shell when the heat dissipation channel is not in use, allowing the device to maintain a compact form factor while providing full heat dissipation capability when required.
3Reliability
If heat dissipation panel contacts heat emitting component directly, then heat transfer efficiency is improved, but surface temperature of device increases affecting user comfort
Solution Approach 1:
The heat dissipation panel acts as an intermediary component between the heat emitting component and the external environment. It efficiently conducts heat away from the component while its positioning within the heat dissipation channel prevents direct contact with the device exterior, thus maintaining low surface temperatures.
4Adaptability or versatility
If sliding assembly is added to enable adjustable heat dissipation channel, then flexibility and space-saving are improved, but device complexity increases
Solution Approach 1:
The sliding assembly is segmented into distinct components (sliding groove, sliding block, driving mechanism) that can be independently manufactured and assembled, reducing overall complexity while providing adjustable functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively dissipates heat from high-performance components, maintaining lower surface temperatures and preventing performance throttling, while offering flexibility and space-saving capabilities through adjustable states.
Implementation Method 1
a first surface of the heat dissipation panel is in contact with a heat emitting component... to transfer heat generated by the heat emitting component to the heat dissipation panel
Implementation Method 2
heat on the heat dissipation panel can be quickly carried away by air in the heat dissipation channel... heat dissipated by the heat dissipation panel quickly flows to the external environment through the heat dissipation channel
Data Source
Figure 1~3
Figure 4~6
Figure 7~8
AI summary
Embodiments of this application disclose a housing structure and a terminal device. The housing structure includes a bottom shell and a lifting shell. A first end of the bottom shell is connected to a first end of the lifting shell, a second end of the bottom shell and a second end of the lifting shell are spaced by a first distance, and space between the bottom shell and the lifting shell forms a heat dissipation channel. A heat dissipation panel is disposed on the bottom shell, a first surface of the heat dissipation panel is in contact with a heat emitting component, and a second surface of the heat dissipation panel is located in the heat dissipation channel. The heat dissipation panel is disposed on the bottom shell, and the first surface of the heat dissipation panel is in contact with the heat emitting component, to transfer heat generated by the heat emitting component to the heat dissipation panel. Because the second surface of the heat dissipation panel is located in the heat dissipation channel formed by the bottom shell and the lifting shell, heat on the heat dissipation panel can be quickly carried away by air in the heat dissipation channel. Therefore, the housing structure provided in the embodiments of this application can better dissipate heat for the heat emitting component in the bottom shell.