Light Bar Assembly Stepped Substrate LED Uniformity

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Solution Overview

Problem

Traditional light bar assemblies using LEDs suffer from dark lines due to uneven light intensity caused by sparse and dense LED arrangements, leading to suboptimal lighting effects and increased costs when trying to address this issue through width expansion.

Innovation Solution

A light bar assembly design featuring substrates with step or inclined profiles and interlaced LED arrangements, where connecting portions protrude outward to allow for efficient space utilization and improved light distribution without increasing substrate width, using connecting devices to fix the substrates and maintain even light intensity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If the substrate width is expanded to dispose bonding material at two ends, then the light intensity uniformity is improved, but the manufacturing cost increases

Engineering Contradiction:
Improvelight intensity uniformityVSAvoidmanufacturing cost
Core Design Contradiction:
Illumination intensityVSEase of manufacture

Solution Approach 1:

The patent transitions from a traditional linear arrangement where bonding material is placed at the ends of substrates to a stepped configuration where bonding pads are arranged in multiple levels. This dimensional reorganization allows bonding material to be disposed in the stepped regions without requiring substrate width expansion, thereby maintaining light intensity uniformity while avoiding increased manufacturing costs.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The substrate connecting region is segmented into multiple stepped levels with different bonding pads (first bonding pad, second bonding pad, third bonding pad, fourth bonding pad) arranged at different heights. This segmentation allows the bonding material to be distributed across multiple stepped regions rather than requiring a single expanded width, achieving uniform light intensity without increasing overall substrate width.

Inventive Principle:
Principle #1Segmentation

2Quantity of substance

If light sources are arranged densely at the center part of the substrate, then the space utilization is improved, but the light intensity uniformity deteriorates causing dark lines

Engineering Contradiction:
Improvespace utilizationVSAvoidlight intensity uniformity
Core Design Contradiction:
Quantity of substanceVSIllumination intensity

Solution Approach 1:

The patent implements different LED arrangement densities in different regions of the substrate. The center part maintains dense LED arrangement for space utilization, while the stepped connecting parts have adjusted LED arrangements that account for the bonding material placement. This local differentiation ensures uniform light intensity across the entire substrate by compensating for the sparse arrangement regions.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent introduces asymmetric stepped structures at the connecting ends of substrates, where bonding pads are arranged at different levels rather than symmetrically. This asymmetric design allows the bonding material to be disposed without creating symmetric sparse regions that would cause dark lines, while maintaining dense LED arrangement in the center for optimal space utilization.

Inventive Principle:
Principle #4Asymmetry

Data Source

PatentUS8783899B2Light bar assembly
Publication Date: 2014.07.22 ENNOSTAR CORP
  • US8783899B2 patent drawing
  • US8783899B2 patent drawing
  • US8783899B2 patent drawing

AI summary

A first substrate of a light bar assembly includes a first edge and a second edge parallel to each other along a first direction. A first connecting end includes a first connecting portion protruding further outward than a second connecting portion. A first bonding pad and a second bonding pad are disposed on the first substrate. First solid-state semiconductor light sources are disposed along the first edge and the second edge. A second substrate, disposed corresponding to the first substrate, includes a third edge, a fourth edge, a second connecting portion, a third bonding pad, a fourth bonding pad, and second solid-state semiconductor light sources. A first connecting device is electrically connected to the first bonding pad and the fourth bonding pad; a second connecting device is electrically connected to the second bonding pad and the third bonding pad to fix the first substrate and the second substrate.