Light Beam Measuring Instrument with Dual-Axis Tilting Mechanism

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Solution Overview

Problem

Conventional light beam measuring instruments face challenges in securely receiving reflected light beams due to the elongated distance and potential tilting of semiconductor chip surfaces during etching, leading to deviations in reflected light that prevent accurate measurement or inspection.

Innovation Solution

A light beam measuring instrument equipped with a first and second optical-axis-tilting mechanism to adjust the light beam source's direction, combined with a translation mechanism and an irradiation position controller, ensures the light beam is correctly returned to the detector, even if the sample surface is tilted, by analyzing the light beam's position and shape using images or detecting the tilting angle.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the light beam is delivered from outside the etching chamber through a small window, then the light beam can reach the semiconductor chip, but the distance between the light beam source and the semiconductor chip becomes elongated, causing reflected light deviation when the chip is tilted

Engineering Contradiction:
Improvelight beam deliveryVSAvoidreflected light detection accuracy
Core Design Contradiction:
Ease of operationVSMeasurement precision

Solution Approach 1:

The patent introduces an optical axis tilting mechanism that enables dynamic adjustment of the light beam source's orientation. This allows the system to adapt to tilted semiconductor chip surfaces by tilting the optical axis accordingly, ensuring reflected light returns to the detector despite chip orientation changes during etching processes.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent changes the orientation parameter of the light beam source by introducing tilting mechanisms that can adjust the optical axis angle. This parameter adjustment compensates for chip tilt variations, maintaining accurate reflected light detection without requiring physical movement of the entire measurement system.

Inventive Principle:
Principle #35Parameter changes

2Adaptability or versatility

If the semiconductor chip is tilted in the package, then the reflected light deviates, but the light beam may not return to the light beam measuring instrument

Engineering Contradiction:
Improvechip orientation toleranceVSAvoidreflected light beam reception
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The optical axis tilting mechanism provides dynamic adaptation to chip orientation changes. By adjusting the light beam source's tilt angle in real-time, the system maintains reliable reflected light reception regardless of chip positioning variations during etching or inspection processes.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system incorporates feedback through detection of the irradiation position and tilting angle, allowing automatic adjustment of the optical axis to ensure the reflected light beam returns to the detector, thereby maintaining reliable operation under varying chip orientations.

Inventive Principle:
Principle #23Feedback

3Measurement precision

If the direction of the optical axis is tilted by the optical axis tilting mechanism, then the light beam reflected by the object can be returned to the detector, but the position on the object irradiated with the light beam moves

Engineering Contradiction:
Improvereflected light detectionVSAvoidirradiation position stability
Core Design Contradiction:
Measurement precisionVSManufacturing precision

Solution Approach 1:

The patent introduces a translation mechanism as an intermediary component that compensates for position shifts caused by optical axis tilting. This mechanism adjusts the irradiation position on the object to maintain stability, allowing the system to both tilt the optical axis for accurate reflected light detection and keep the irradiation point fixed on the target location.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The system applies different adjustments to different aspects of the optical system: the optical axis tilting mechanism adjusts the beam direction for accurate detection, while the translation mechanism specifically addresses the irradiation position stability. This localized adjustment approach allows each mechanism to optimize its specific function without interfering with the other.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution allows for secure and accurate measurement or inspection by ensuring the light beam is always returned to the detector, enabling proper measurement and inspection without the need to move the object, even during processes like etching.

Implementation Method 1

a light beam source for emitting a light beam toward an object, and a light beam detector for detecting the light beam reflected by a surface of the object

Methodology Applied
Scientific EffectReflection: Reflection

Data Source

PatentUS9488519B2Measuring instrument using light beam
Publication Date: 2016.11.08 SAMCO INC
  • US9488519B2 patent drawing
  • US9488519B2 patent drawing
  • US9488519B2 patent drawing

AI summary

The present invention provides a light beam measuring instrument that can securely receive light reflected by a sample. The light beam measuring instrument 1 includes an optical axis tilting mechanism 13 that includes a first tilting mechanism 131 and a second tilting mechanism 132. From the optical axis A1 of irradiation light beam emitted from a light beam source 112, the first tilting mechanism 131 tilts the optical axis A1 about the first tilting axis T1. The second tilting mechanism 132 tilts the optical axis A1 about the second tilting axis T2. The light beam measuring instrument 1 can receive the light reflected by the semiconductor chip C by means of operation of the optical axis tilting mechanism 13 even if the light reflected by the semiconductor chip C is tilted. Accordingly, this apparatus can securely perform measurement or inspection using the light beam.