Light Blocking Layer in Image Sensor Package for Edge Reflection Reduction
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Solution Overview
Problem
The miniaturization of image sensor packaging leads to ineffective heat dissipation and frustration with dated assembly techniques, as new smaller components struggle to manage mechanical abrasion, excessive heat, and electrostatic discharge, while maintaining high resolution and low power consumption.
Innovation Solution
The implementation of a light blocking layer disposed in recessed regions of a transparent shield within the image sensor package, which prevents edge reflections and glare by positioning the light blocking layer away from the pixel array, allowing for efficient optical path maintenance and reducing unwanted optical effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the image sensor package is miniaturized to achieve higher resolution and lower power consumption, then the device size and power consumption are improved, but heat dissipation effectiveness deteriorates
Solution Approach 1:
The patent divides the packaging structure into distinct functional segments: a first packaging component housing the image sensor die, and a second packaging component serving as a heat dissipation element. This segmentation allows the heat dissipation function to be separated from the miniaturized sensor package, enabling effective thermal management independent of the sensor's small size.
Solution Approach 2:
The patent extends the solution into a third dimension by stacking the image sensor die above the heat dissipation element, creating a vertical thermal conduction path. This dimensional arrangement allows heat to be efficiently conducted away from the miniaturized sensor through the underlying heat dissipation component, overcoming the limited surface area for heat dissipation in small packages.
2Ease of manufacture
If dated assembly techniques are used in miniaturized packaging, then manufacturing simplicity is maintained, but assembly effectiveness deteriorates due to miniature size constraints
Solution Approach 1:
The patent segments the assembly process into distinct stages: first forming the sensor package with the image sensor die, then separately forming the heat dissipation component, and finally coupling them together. This segmentation allows each component to be optimized and tested independently before final assembly, improving reliability despite using relatively simple assembly techniques.
Solution Approach 2:
The patent performs preliminary actions by pre-forming the heat dissipation element as a separate component with its structure prepared in advance. This preliminary preparation allows the heat dissipation component to be designed and manufactured with optimal thermal characteristics before being integrated with the miniaturized sensor package, ensuring assembly effectiveness.
3Object-affected harmful factors
If the light blocking layer is positioned closer to the pixel array, then edge reflection prevention is improved, but optical path obstruction increases
Solution Approach 1:
The patent resolves the contradiction by moving the light blocking layer from the horizontal plane to the vertical dimension. The light blocking layer is positioned on the lateral edges of the transparent shield, extending downward into recessed regions away from the pixel array plane. This vertical positioning allows the light blocking layer to intercept edge reflections without obstructing the horizontal optical path to the pixel array.
Solution Approach 2:
The patent applies local quality by positioning the light blocking layer specifically at the lateral edges of the transparent shield where edge reflections occur, rather than uniformly across the entire shield. The light blocking layer is confined to recessed regions at specific locations, providing targeted reflection prevention only where needed, while leaving the central optical path clear for efficient light transmission to the pixel array.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively mitigates edge reflections and glare, enhancing image quality while addressing the challenges of heat dissipation and mechanical protection in miniaturized image sensor packaging.
Implementation Method 1
A light blocking layer is disposed in recessed regions of a transparent shield
Implementation Method 2
transparent shield within the image sensor package, which prevents edge reflections and glare by positioning the light blocking layer away from the pixel array, allowing for efficient optical path maintenance
Data Source
AI summary
A method of image sensor package fabrication includes providing an image sensor, including a pixel array disposed in a semiconductor material, and a first transparent shield adhered to the semiconductor material. The pixel array is disposed between the semiconductor material and the first transparent shield. A light blocking layer is deposited and disposed between lateral edges of the pixel array and lateral edges of the first transparent shield, and a second transparent shield is placed on the image sensor package, where the light blocking layer is disposed between the first transparent shield and the second transparent shield.