Light Board With Insulating Layer For Heat Sink
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Solution Overview
Problem
Securing light boards with LED arrays to heat sinks is challenging due to the placement of circuit elements on the opposing surface, which can lead to shorting without insulating materials, complicating assembly and installation.
Innovation Solution
A light board design featuring a first layer with LED arrays and circuit elements on one surface, and a second insulating layer with circuit elements between the first and second layers, allowing for secure attachment to a heat sink using an adhesive, preventing shorting and facilitating assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If circuit elements are placed on the opposing surface of the first layer for powering LED arrays, then electrical connectivity and power distribution are achieved, but shorting occurs when attached to heat sinks without insulating materials
Solution Approach 1:
A second insulating layer is introduced as an intermediary between the circuit elements on the first layer and the heat sink. This intermediate layer provides both electrical insulation to prevent shorting and thermal conduction path for heat dissipation, resolving the contradiction between maintaining electrical connectivity and preventing harmful shorting effects.
Solution Approach 2:
The light board employs a composite structure consisting of a first layer (insulating material) and a second layer (heat sink interface material). This composite design combines materials with different properties - one providing electrical insulation and the other facilitating thermal management - to simultaneously achieve reliable electrical connectivity while preventing shorting against the heat sink.
2Reliability
If a second insulating layer is added to prevent shorting between circuit elements and heat sink, then shorting is prevented, but device complexity and assembly steps increase
Solution Approach 1:
The second insulating layer is merged with the heat sink attachment structure, serving dual functions as both an electrical insulator and a thermal interface layer. By combining these functions into a single integrated layer rather than adding separate insulating and thermal management components, the design prevents shorting while minimizing increases in device complexity.
Solution Approach 2:
The second layer is designed to perform multiple functions simultaneously: providing electrical insulation to prevent shorting, facilitating thermal conduction from the LED arrays to the heat sink, and serving as an attachment interface for securing the light board to the heat sink. This multi-functionality reduces overall device complexity despite adding a layer.
3Productivity
If circuit elements are placed on the opposing surface for powering LEDs, then power distribution is achieved, but assembly and installation become complicated due to shorting risks
Solution Approach 1:
The second insulating layer is pre-integrated into the light board structure during manufacturing, positioned exactly where needed to prevent shorting. This preliminary action eliminates the need for operators to manually add insulating materials during assembly, maintaining efficient power distribution while simplifying the assembly process by pre-resolving the shorting risk.
Solution Approach 2:
The layered structure with the second insulating layer is designed to be self-protecting against shorting without requiring additional assembly steps or external insulating materials. The structure itself provides the necessary insulation, making the assembly process simpler and more straightforward while maintaining efficient power distribution to the LED arrays.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables secure and efficient assembly of light boards into lighting fixtures without shorting, ensuring reliable operation and ease of installation by using an insulating layer to isolate circuit elements from the heat sink.
Implementation Method 1
a second layer disposed on the second surface of the first layer such that the one or more circuit elements are located between the second surface of the first layer and the second layer
Implementation Method 2
a heat sink and a light board coupled to the heat sink
Implementation Method 3
allowing for secure attachment to a heat sink using an adhesive
Data Source
AI summary
Light boards including one or more light emitting elements (e.g. light emitting diode (LED) devices) for use in lighting fixtures are disclosed. In one example implementation, a light board includes a first layer having a first surface and an opposing second surface. The light board includes one or more light emitting elements disposed on the first surface of the first layer. The light board includes one or more circuit elements located on the second surface of the first layer. The one or more circuit elements are associated with powering the one or more light emitting elements. The light board includes a second layer disposed on the second surface of the first layer such that the one or more circuit elements are located between the second surface of the first layer and the second layer.