Light-Emitting Board Structure for Warpage and Noise Suppression
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Solution Overview
Problem
Existing light-emitting devices face challenges in achieving high reliability and flatness, particularly in high-temperature environments, due to issues such as warpage and noise occurrence.
Innovation Solution
A light-emitting device is designed with a first board that includes a substrate, light-emitting elements with a multilayer film, and a structure in the interelement region, where the structure has the same multilayer film or is made of the same material as the substrate. This configuration includes an insulator film composed of inorganic material to fill gaps and improve reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a light-emitting device uses conventional interelement region structures, then manufacturing is simpler, but warpage and noise occur in high-temperature environments reducing reliability
Solution Approach 1:
The patent applies homogeneity by making the structure in the interelement region have the same multilayer film composition as the light-emitting elements, or be composed of the same material as the first substrate. This material uniformity ensures consistent thermal expansion characteristics across the entire device, preventing warpage and noise in high-temperature environments while maintaining structural integrity and reliability.
Solution Approach 2:
The patent changes the material parameters of the interelement region structure to match either the light-emitting elements' multilayer film or the substrate material. This parameter alignment (in terms of material composition and thermal properties) resolves the contradiction by enabling the device to maintain reliability under thermal stress without requiring overly complex additional structures.
2Shape
If the structure in the interelement region uses different material than the substrate, then manufacturing flexibility increases, but flatness deteriorates due to warpage
Solution Approach 1:
By making the interelement region structure homogeneous with the surrounding light-emitting elements and substrate (same multilayer film or substrate material), the patent eliminates material interfaces that would cause differential thermal expansion. This ensures flatness is maintained in high-temperature environments while the manufacturing process remains flexible in choosing the specific material system.
3Reliability
If gap portions between light-emitting elements are left empty, then device complexity is reduced, but noise occurs reducing reliability
Solution Approach 1:
The patent fills the gap portions between light-emitting elements with a structure having the same multilayer film or substrate material, creating a homogeneous continuous structure. This eliminates voids that would generate noise and improve reliability, while the filling process integrates seamlessly with existing manufacturing steps without significantly increasing device complexity.
Data Source
AI summary
[Problem] To provide a light-emitting device with high reliability.[Solution] A light-emitting device 10 includes a first board 20, the first board 20 including a first substrate 21, light-emitting elements 22, each being disposed on a first side S1 of the first substrate 21 and having a multilayer film 22L, and a structure 23 disposed in an interelement region between the light-emitting elements 22 on the first side S1, the structure 23 having the same multilayer film 22L as the light-emitting element 22 or being composed of the same material as the first substrate 21.