Edge-Emitting Light Cap Alignment During Adhesive Curing

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Solution Overview

Problem

Current semiconductor light emitting devices face challenges in maintaining the position and alignment of the cap relative to the substrate during the curing of the adhesive, which can lead to displacement and potential contact with the light emitting element, affecting the device's performance and reliability.

Innovation Solution

The use of a restriction member with a frame shape surrounding the edge-emitting light emitting element on the substrate, in conjunction with a cap design featuring side walls and an adhesive pattern, ensures precise positioning and restricts movement of the cap during adhesive curing, preventing contact with the light emitting element.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the cap is bonded to the substrate using adhesive during curing, then the cap is securely attached to the substrate, but the cap may displace or contact the light emitting element during the curing process

Engineering Contradiction:
Improvebonding strengthVSAvoidposition stability
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent applies adhesive to the substrate surface before placing the cap, and positions the cap precisely before the adhesive fully cures. This preliminary positioning action ensures the cap is correctly aligned with the light emitting element before the bonding process completes, preventing displacement during curing.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent introduces a positioning structure or alignment mechanism as an intermediary between the cap and the light emitting element. This intermediary component ensures proper spatial relationship and prevents direct contact between the cap and the light emitting element during the bonding process, maintaining both bonding strength and position stability.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Volume of moving object

If the cap is positioned close to the light emitting element for compact design, then the device size is reduced, but the cap may contact the light emitting element during adhesive curing

Engineering Contradiction:
Improvedevice sizeVSAvoidcontact risk
Core Design Contradiction:
Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a positioning structure or alignment mechanism as an intermediary between the cap and the light emitting element. This intermediary component ensures proper spatial relationship and prevents direct contact between the cap and the light emitting element during the bonding process, maintaining both bonding strength and position stability.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs preliminary positioning measures such as alignment marks, positioning pins, or fixed spatial relationships defined in the positioning structure. These preliminary anti-actions prevent the cap from displacing toward the light emitting element during adhesive curing, counteracting the potential harmful contact before it can occur.

Inventive Principle:
Principle #9Preliminary anti-action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively limits the displacement of the cap relative to the substrate, maintaining the integrity of the light transmission surface and enhancing the device's operational stability and reliability.

Implementation Method 1

The cap is bonded to the substrate using an adhesive

Methodology Applied
Scientific EffectAdhesive bonding: Adhesive

Data Source

PatentUS20240388058A1Semiconductor light emitting device and method for manufacturing semiconductor light emitting device
Publication Date: 2024.11.21 ROHM CO LTD
  • US20240388058A1 patent drawing
  • US20240388058A1 patent drawing
  • US20240388058A1 patent drawing

AI summary

A semiconductor light emitting device includes a substrate, an edge-emitting light emitting element, an adhesion pattern, a cap, an adhesive, and a restriction member. The adhesion pattern has a frame shape surrounding the edge-emitting light emitting element. The cap includes first to fourth side walls and accommodates the edge-emitting light emitting element. The first to fourth side walls are opposed to the adhesion pattern in the Z-direction. The first to fourth side walls have a frame shape and include an opening end surface and an inner side surface. The adhesive bonds the opening end surface of the first to fourth side walls to the pattern surface of the adhesion pattern. The restriction member is disposed on the substrate and is in contact with the inner side surface of the first to fourth side walls so as to restrict movement of the cap in a direction intersecting the Z-direction.