Light-Emitting Chip Raised Structure for Uniform LED Soldering
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Solution Overview
Problem
The existing methods for manufacturing light-emitting diodes (LEDs) face challenges in achieving consistent and high-yield soldering due to the discontinuous nature of solder joints, which affects the reliability and compatibility of mini and micro LEDs with different sizes, leading to issues with electrical connections and mechanical stress during the soldering process.
Innovation Solution
The introduction of a light-emitting chip design featuring a raised portion and sub-light-emitting auxiliary bonding layers, where the raised portion is smaller than the bonding layers and does not overlap with their orthographic projections, allowing for controlled solder joint thickness and increased tension during soldering, thereby enhancing the yield and compatibility with various LED sizes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional LED manufacturing methods are used, then production process is simple, but soldering yield is low and reliability is poor
Solution Approach 1:
The chip structure is segmented into distinct functional regions: a light-emitting region with the light-emitting layer and semiconductor layers, and a non-light-emitting region with the raised portion. This segmentation allows the soldering function to be separated from the light-emitting function, enabling optimized soldering without compromising light emission quality.
Solution Approach 2:
The invention introduces a vertical dimension by creating a raised portion that protrudes from the chip surface. This three-dimensional structure provides an additional soldering surface and increases the effective bonding area, thereby improving soldering reliability without expanding the planar footprint of the chip.
2Manufacturing precision
If solder joint thickness is not controlled, then manufacturing process is simple, but soldering yield is inconsistent
Solution Approach 1:
The raised portion is formed on the chip before the soldering process, pre-establishing a controlled geometry that will receive the solder material. This preliminary structural preparation ensures that when solder is applied, it is confined to a specific region and thickness, achieving precise solder joint control without requiring complex real-time monitoring during soldering.
3Measurement precision
If LED size is miniaturized, then resolution is improved, but compatibility with different sizes is reduced
Solution Approach 1:
The raised portion structure serves multiple functions: it provides a soldering surface for small mini-LEDs, maintains adequate solder joint thickness for proper bonding, and ensures mechanical stability. This universal structure can be applied across different LED sizes, from mini-LEDs to micro-LEDs, making the manufacturing process compatible with various dimensions while maintaining high resolution.
4Quantity of substance
If solder material is reduced, then cost is reduced, but electrical connection reliability is compromised
Solution Approach 1:
The raised portion concentrates the solder material in a specific localized region rather than requiring a large area of solder. This local concentration ensures that the electrical connection is formed at the most critical interface between the chip and substrate, maintaining connection reliability while using less overall solder material.
Data Source
AI summary
Provided are a light-emitting chip, a light-emitting substrate, a display device, and a manufacturing method for a light-emitting substrate. The light-emitting chip includes: a substrate; a light-emitting structure, the light-emitting structure disposed on a side of the substrate; a reflective layer disposed on a side, facing away from the substrate, of the light-emitting structure; at least two sub-light-emitting auxiliary bonding layers disposed on a side, facing away from the light-emitting structure, of the reflective layer; and a raised portion, disposed on a side, facing away from the light-emitting structure, of the reflective layer, an orthographic projection of the raised portion on the substrate and an orthographic projection of the sub-light-emitting auxiliary bonding layers on the substrate do not overlap with each other, and a thickness of the raised portion is smaller than a thickness of each of the at least two sub-light-emitting auxiliary bonding layers.