Light-Emitting Chip Stack With Conductive Vias for Higher Resolution
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Solution Overview
Problem
Existing electronic devices face challenges in reducing costs, increasing energy conversion efficiency, and minimizing damage during transportation and wiring design complexity.
Innovation Solution
The electronic device incorporates light-emitting units, driving circuits, and controlling circuits disposed on separate substrates, with driving transistors having higher electron mobility and integrated into chips to alleviate IR drops, and using low-resistivity materials for wiring to enhance energy efficiency and reduce damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If light-emitting units, driving circuits, and controlling circuits are disposed on different substrates, then manufacturing cost is reduced and energy conversion efficiency is improved, but device complexity increases
Solution Approach 1:
The patent divides the electronic device into multiple independent substrates: a first substrate for light-emitting units, a second substrate for driving circuits, and a third substrate for controlling circuits. This segmentation allows each substrate to be manufactured separately using optimized processes, reducing overall manufacturing cost while enabling parallel production and assembly.
Solution Approach 2:
The patent extracts the driving circuits and controlling circuits from the light-emitting unit substrate and places them on separate substrates. This extraction reduces the complexity and cost of manufacturing each individual substrate while maintaining functional integration through controlled connections.
2Use of energy by moving object
If driving transistors with higher electron mobility are used, then energy conversion efficiency is improved, but manufacturing cost increases
Solution Approach 1:
The patent applies different material qualities to different regions: high-electron-mobility materials are used specifically in the driving transistor channels where high performance is critical for energy efficiency, while other parts of the device use standard, lower-cost materials. This localized application of high-performance materials optimizes energy conversion efficiency without uniformly increasing manufacturing cost across the entire device.
Data Source
AI summary
An electronic device including at least one light emitting chip, a circuit chip, and a base is provided. The base having a first surface, a second surface opposite to the first surface and at least one conductive via extending from the first surface to the second surface, the base is disposed between the at least one light emitting chip and the circuit chip, and the base is greater than one of the at least one light emitting chip in thickness. The circuit chip is electrically connected to the at least one light emitting chip through the at least one conductive via and configured to control the at least one light emitting chip.