Light Compensating Structure for Array Substrate Exposure

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

High-resolution display devices face issues with uneven resin layers causing photoresist layer thickness variations, leading to insufficient exposure and residue formation during patterning processes, which can result in short circuits between adjacent pixel structures and affect their operation.

Innovation Solution

An array substrate with a light compensating structure made of opaque and reflective materials, such as tungsten or aluminum, is introduced under uneven portions of the insulating layer to improve exposure efficiency in photolithographic processes, ensuring uniform light distribution and reducing the risk of residue formation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a resin layer is used for electrical isolation between electrodes, then electrical isolation is achieved, but uneven thickness of the resin layer causes photoresist layer thickness variations leading to insufficient exposure and residue formation

Engineering Contradiction:
Improveelectrical isolationVSAvoidphotoresist layer thickness uniformity
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent introduces a light compensating structure at specific locations where the resin layer is thinnest (between adjacent via holes). This structure provides localized light enhancement only where needed, rather than uniformly thickening the entire resin layer. The light compensating structure reflects light back to the photoresist layer, ensuring sufficient exposure in the critical thin-resin regions while maintaining the overall electrical isolation function.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The light compensating structure acts as an intermediary element between the light source and the photoresist layer. It receives light and redirects it to illuminate the photoresist layer in regions with thin resin, effectively mediating the light transmission process to compensate for the uneven resin thickness without compromising the resin's electrical isolation property.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If extended light exposure is used to develop the thicker photoresist layer, then sufficient exposure is achieved, but production speed is reduced

Engineering Contradiction:
Improvephotoresist layer exposure completenessVSAvoidproduction speed
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The light compensating structure is prepared in advance during the fabrication process, positioned precisely where the resin layer is thinnest. This preliminary arrangement ensures that when light exposure occurs, the photoresist layer receives enhanced illumination in the critical regions, eliminating the need for extended exposure time and maintaining normal production speed.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent converts the harmful effect of the thin resin layer (which causes uneven photoresist thickness) into a beneficial configuration by positioning the light compensating structure to reflect light specifically to the photoresist layer in these thin-resin regions. The previously problematic thin-resin areas become the focal points for light enhancement, ensuring complete exposure without requiring extended processing time.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

3Measurement precision

If via holes are placed close together for high resolution, then display resolution is improved, but uneven resin layer thickness increases causing electrode residues and short circuiting risk

Engineering Contradiction:
Improvepixel electrode spacingVSAvoidshort circuiting risk
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

The light compensating structure is strategically positioned at the locations where the resin layer is thinnest, which are precisely the areas between adjacent via holes. This localized approach ensures that light enhancement is provided exactly where the close spacing of via holes creates the most severe resin thickness variations, preventing electrode residues and short circuiting in these critical high-resolution regions.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The light compensating structure serves as an intermediary that mediates between the close spacing of via holes and the photoresist layer. It receives light and redirects it to illuminate the photoresist layer in the narrow gaps between via holes, ensuring complete exposure and preventing residues that could cause short circuits, thereby enabling high-resolution design.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The light compensating structure enhances exposure efficiency, reduces the risk of short circuits, and increases production speed by ensuring proper patterning of pixel electrodes and other structures, thereby improving the accuracy and functionality of adjacent pixel structures.

Implementation Method 1

The light compensating structure is made of an opaque and reflective material

Methodology Applied
Scientific EffectLight reflection: Reflection

Data Source

PatentUS10481445B2Array substrate and fabrication method thereof, and display device
Publication Date: 2019.11.19 BOE TECHNOLOGY GROUP CO LTD
  • US10481445B2 patent drawing
  • US10481445B2 patent drawing
  • US10481445B2 patent drawing

AI summary

An array substrate, a fabrication method of the array substrate, and a display device including the array substrate are provided. The array substrate includes a first electrode (54) including a plurality of first sub-electrodes, a second electrode (3) including a plurality of second sub-electrodes, and an insulating layer (6) disposed between the first electrode (54) and the second electrode (3). A plurality of via holes (61) are formed in the insulating layer (6), and the plurality of the second sub-electrodes are electrically connected to the plurality of the first sub-electrodes correspondingly through the plurality of the via holes (61). The array substrate further includes a light compensating structure (4) disposed under an uneven portion of the insulating layer (6) to locally improve an exposure efficiency in a photolithographic process for forming the second electrode (3).