Light Conversion Mounting Structure for Compact Heat Dissipation
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Solution Overview
Problem
Existing light conversion components face challenges in optimizing heat dissipation and luminous efficiency, particularly in applications with limited space, such as picoprojectors, while also aiming to minimize the cost of thermally conductive carrier substrates.
Innovation Solution
A light conversion component with a thermally conductive carrier substrate and a connector, optimized for mounting on a heat exchanger, featuring specific dimensions and materials to enhance heat dissipation and luminous efficiency, including a carrier substrate with defined characteristic length, height, and thermal resistance, and a connector with high thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the carrier substrate is made larger to improve heat dissipation, then heat dissipation performance is improved, but the device size increases and space is consumed
Solution Approach 1:
The patent applies local quality by creating a non-uniform thickness profile in the carrier substrate, with a first thickness in a first region and a second thickness in a second region. This allows different areas of the substrate to have optimized thermal and mechanical properties, enabling effective heat dissipation while maintaining a compact overall size. The varying thickness distributes thermal pathways efficiently without requiring a uniformly large substrate area.
2Stability of the object's composition
If the carrier substrate thickness is increased to improve mechanical stability, then mechanical stability is improved, but the device height increases and space is consumed
Solution Approach 1:
The patent implements local quality by specifying different thickness values for different regions of the carrier substrate. The first region has a first thickness optimized for mechanical stability, while the second region has a second thickness that reduces overall device height. This regional differentiation allows the substrate to achieve adequate mechanical stability without requiring uniform thickness throughout, thereby minimizing the overall device height and space consumption.
3Temperature
If expensive high-performance materials are used for the carrier substrate to improve thermal conductivity, then heat dissipation is improved, but manufacturing cost increases
Solution Approach 1:
The patent applies parameter changes by optimizing the thickness parameters of the carrier substrate in different regions. Instead of relying solely on expensive high-performance materials, the invention achieves improved heat dissipation by carefully controlling the first thickness and second thickness values. This allows the use of more cost-effective materials while still meeting thermal performance requirements through geometric optimization, thereby reducing manufacturing cost.
4Temperature
If the light conversion element is firmly fixed to maximize heat transfer, then heat dissipation is improved, but the ability to exchange or replace the element is reduced
Solution Approach 1:
The patent implements dynamics by creating a mechanically stable but releasable connection between the light conversion element and the carrier substrate. The non-uniform thickness design allows for optimized thermal contact in the first region while maintaining ease of assembly and disassembly. This dynamic approach enables the connection to be firm enough for effective heat transfer during operation, yet easily reversible for element exchange or replacement, satisfying both heat dissipation and adaptability requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves improved heat dissipation and luminous efficiency, allowing for compact designs and reduced material costs, while maintaining a mechanically stable and thermally efficient connection.
Implementation Method 1
a thermally conductive connector, which is arranged between the light conversion element and the carrier substrate, and which establishes a mechanically fixed connection
Implementation Method 2
a thermally conductive carrier substrate, which carries the light conversion element, wherein the carrier substrate has a carrier front side facing the rear side of the light conversion element and has a carrier rear side configured for bearing on a heat exchanger
Implementation Method 3
the light conversion element is configured to be irradiated with primary light on its front side and to emit secondary light with a wavelength changed relative to the primary light on its front side
Data Source
AI summary
A light conversion component for mounting on a heat exchanger including: a light conversion element having a front side and a rear side, wherein the light conversion element is configured to be irradiated with primary light on its front side and to emit secondary light with a wavelength changed relative to the primary light on its front side, and a thermally conductive carrier substrate, which carries the light conversion element, wherein the carrier substrate has a carrier front side facing the rear side of the light conversion element, and has a carrier rear side configured for bearing on the heat exchanger, and a thermally conductive connector, which is arranged between the light conversion element and the carrier substrate and which establishes a mechanically fixed connection.