Light Communication Device Terminal Coupling via 3D Substrate
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Solution Overview
Problem
In light communication devices, it is challenging to appropriately bend flexible substrates without increasing the area used for terminal coupling, leading to excessive electric power loss due to mismatched intrinsic impedance between rigid and flexible substrates.
Innovation Solution
The configuration includes a rigid substrate with a first terminal on its surface and a second terminal with a hole, along with third and fourth terminals on the package's side wall, allowing the flexible substrate to be arranged along the side wall with its distal end near the package and proximal end near the rigid substrate, reducing the coupling area and improving impedance matching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the first terminal is arranged at a predetermined distance from the package to allow appropriate bending of the flexible substrate, then the flexible substrate can be properly bent, but the area of the region used to couple the terminal of the package and the terminal of the rigid substrate excessively increases
Solution Approach 1:
The invention transitions the terminal arrangement from a planar two-dimensional layout to a three-dimensional spatial configuration. The first terminal is positioned on the surface of the rigid substrate, while the second terminal extends through a hole to the side wall, allowing the flexible substrate to connect in three-dimensional space rather than being constrained to a flat coupling region.
Solution Approach 2:
The second terminal is formed by a conductive structure that passes through the hole in the rigid substrate, with part of it nested within the substrate thickness and part extending to the side wall. This nested configuration allows the terminal to occupy space in multiple dimensions without increasing the surface area.
2Ease of operation
If the first terminal is arranged at a predetermined distance from the package, then the flexible substrate can be appropriately bent, but the intrinsic impedance mismatch between rigid and flexible substrates increases causing electric power loss
Solution Approach 1:
The invention changes the geometric parameters of the terminal structure, specifically the cross-sectional area and shape of the second terminal, to control its intrinsic impedance. By adjusting these parameters, the impedance of the rigid substrate terminal can be matched to the flexible substrate terminal, minimizing reflections and power loss while maintaining bending flexibility.
Data Source
AI summary
A light communication device further includes a rigid substrate, a package, and a flexible substrate. The rigid substrate includes a first terminal arranged on a surface thereof and a second terminal having a first hole opened at the surface. The package includes a third terminal and a fourth terminal being provided on a side wall thereof and being electrically coupled to a signal electrode and a ground electrode of the signal processor, respectively. The flexible substrate includes a fifth terminal and a sixth terminal being electrically coupled to the third terminal and the fourth terminal, respectively. The fifth terminal is electrically coupled to the first terminal on the surface, and the sixth terminal, with being placed into the first hole, is electrically coupled to the second terminal.