Light-Curing Resin Composition for High Thermal Conductivity
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Solution Overview
Problem
Current methods for preparing thermally conductive resin compositions face challenges such as low thermal conductivity, poor adhesiveness, and complex synthesis processes, making it difficult to achieve high-performance thermally conductive films for electronic circuits.
Innovation Solution
A light- or heat-curing method using a combination of aluminum alkoxide, silane coupling agents with mercapto groups, and a base-and-radical generator compound that facilitates uniform mixing and high filler loading, enabling efficient solation-gelation and thiol-ene reactions to produce a cured product with improved thermal conductivity and adhesiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a resin composition contains 70% or more of filler to improve thermal conductivity, then thermal conductivity is improved, but multiple synthesis steps are required and productivity is low
Solution Approach 1:
The invention changes the curing method from thermal curing to light curing, which fundamentally alters the curing parameters and enables fast curing without long-term high-temperature heating. This parameter change resolves the contradiction by maintaining high filler content (70% or more) for thermal conductivity while achieving high productivity through rapid light curing
Solution Approach 2:
The invention replaces the thermal curing mechanism with a light-based curing mechanism. Instead of using heat to initiate and sustain the curing reaction, light irradiation activates the photoinitiator to generate radicals that rapidly cure the resin. This substitution eliminates the need for long-term high-temperature heating while maintaining the high filler content necessary for thermal conductivity, thus resolving the productivity contradiction
2Productivity
If light curing is used to improve productivity, then productivity is improved, but curing becomes insufficient when filler scatters light and adhesiveness is poor
Solution Approach 1:
The invention introduces a silane coupling agent as an intermediary substance that bridges the filler particles and the resin matrix. The silane coupling agent contains both inorganic-binding groups (for bonding to filler surfaces) and organic-reactive groups (for participating in light-curing reactions). This intermediary resolves the contradiction by enabling sufficient light penetration and curing even with high filler content, while simultaneously improving adhesiveness to the base material
Solution Approach 2:
The invention creates a composite resin system combining organic polymer matrix, inorganic filler particles, and silane coupling agent. This composite structure allows the system to benefit from the light-curing speed of the organic component while the silane coupling agent ensures proper adhesion and reduces light scattering effects. The composite material approach resolves the contradiction between productivity improvement through light curing and reliability maintenance through adequate adhesiveness
3Manufacturing precision
If strong acid is generated by light irradiation to cure epoxy-based monomer, then curing performance is improved, but corrosion occurs and application to copper plate is difficult
Solution Approach 1:
The invention extracts and eliminates the harmful strong acid generation mechanism from the light-curing system. Instead of using photoinitiators that generate strong acids (which cause corrosion), the invention selects photoinitiators that generate only radicals or mild bases. This extraction of the harmful component resolves the contradiction by maintaining adequate curing performance through radical generation while eliminating corrosion issues that would prevent application to copper plates
Solution Approach 2:
The invention changes the chemical parameters of the photoinitiator system from acid-generating types to radical-generating or mild base-generating types. This parameter change in the photoinitiator chemistry allows the system to achieve sufficient curing performance through radical polymerization mechanisms while avoiding the corrosive strong acid byproducts, thus resolving the contradiction between curing performance and corrosion prevention
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves a thermally conductive resin with enhanced alkali developability, organic solvent resistance, and high strength, capable of reaching thermal conductivity levels of 1.0 W/m·K or more, suitable for electronic circuit applications.
Implementation Method 1
The light curing is a method in which various active species such as radicals, acids, and bases are generated from a photoinitiator by irradiating a resin composition with light (active energy rays) while making the photoinitiator coexist in the resin composition, and reactive monomers are quickly cured using the active species.
Implementation Method 2
a compound that is formed of a salt of a carboxylic acid and an amine and has a carbonyl group generating a radical and a carboxylate group generating a base through decarboxylation by irradiation with light or heating
Data Source
AI summary
An object of the present invention is to provide a light- or heat-curing method by which a cured product (crosslinked product or resin) can be prepared in a simple method even in a case where filler is contained in a large amount; a curable resin composition which is used in the curing method; and the like.The present invention provides a light- or heat-curing method containing a step 1 of obtaining (E) a condensate having constitutional units of Si—O—Al and/or Si—O—Si, obtained from aluminum derived from an aluminum alkoxide and a silane derived from a silane coupling agent having a mercapto group, from (A) a compound that is formed of a salt of a carboxylic acid and an amine and has a carbonyl group generating a radical and a carboxylate group generating a base through decarboxylation by irradiation with light or heating, the (B) aluminum alkoxide, the (C) silane coupling agent having a mercapto group, and (D) water, and a step 2 of performing a reaction among the (E) condensate, (H) a compound having two or more polymerizable unsaturated groups, and (I) filler under the conditions of irradiation with light or heating in the presence of the (A) compound; a curable resin composition which is used in the curing method; and the like.