Light-Debonding Adhesive Composition for Wafer Integrity
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Solution Overview
Problem
Conventional adhesive compositions for temporary bonding in semiconductor wafer processing generate heat during laser-induced debonding, risking damage to wafers and requiring excessive force for removal, which can lead to deformation or breakage.
Innovation Solution
A light-absorbing organic compound, such as a thioindigo derivative, is integrated into the adhesive composition, allowing for heat-resistant bonding during processing and easy debonding through laser irradiation without applying excessive force, using a formulation that includes a polysiloxane component cured via hydrosilylation and specific siloxane units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional adhesive compositions are used for temporary bonding, then bonding strength during polishing is achieved, but heat is generated during laser irradiation causing wafer damage
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive by incorporating specific light-absorbing organic compounds (compounds 1-6) with defined molecular structures containing aromatic rings, heteroatom rings, and carbonyl or thiocarbonyl groups. This compositional parameter change enables selective laser absorption at specific wavelengths while maintaining bonding strength, thereby controlling heat generation characteristics during debonding
Solution Approach 2:
The adhesive composition is formulated as a composite material combining inorganic adhesive components (such as siloxane-based adhesives) with organic light-absorbing compounds. This composite structure allows the adhesive to simultaneously provide mechanical bonding strength and controlled optical absorption properties for selective laser-induced debonding without excessive heat generation
2Ease of operation
If excessive force is applied to remove the support, then debonding is achieved, but wafer breakage or deformation occurs
Solution Approach 1:
The patent replaces the mechanical debonding system (applying excessive force) with an optical system (laser irradiation). The light-absorbing organic compounds in the adhesive absorb laser energy and convert it to localized heat, causing controlled degradation of the adhesive's bonding properties. This allows debonding to occur through chemical/thermal mechanisms rather than mechanical force, preventing wafer damage while achieving easy removal
Solution Approach 2:
The light-absorbing organic compounds act as intermediary substances between the laser energy and the adhesive bonding interface. These compounds absorb laser energy and mediate the energy transfer to the adhesive matrix, causing controlled breakdown of the adhesive's bonding structure. This intermediary mechanism enables gentle, controlled debonding without direct mechanical stress on the wafer
3Stability of the object's composition
If the adhesive withstands polishing stress, then bonding stability is maintained, but debonding requires excessive force
Solution Approach 1:
The adhesive's bonding properties are made dynamic through the inclusion of light-absorbing compounds. During polishing, the adhesive maintains stable bonding under mechanical stress. Upon laser irradiation, the dynamic response is triggered: the light-absorbing compounds absorb energy and induce rapid changes in the adhesive's molecular structure, causing bonding strength to decrease. This dynamic behavior allows the adhesive to adapt its properties based on the operational phase (bonding vs. debonding)
Solution Approach 2:
The adhesive exhibits periodic functionality: first maintaining strong bonding during the polishing phase, then transitioning to weak bonding during the debonding phase upon laser irradiation. The light-absorbing organic compounds enable this periodic behavior by remaining inert during mechanical polishing but becoming active when exposed to laser energy, thus cycling between bonding and debonding states as needed
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition effectively bonds semiconductor wafers during processing and allows for debonding with reduced bonding strength upon laser light absorption, preventing damage and enabling easy separation without excessive force, thus ensuring wafer integrity and efficient processing.
Implementation Method 1
the adhesive composition comprises an adhesive component (S) and a light-absorbing organic compound (X)... can achieve debonding through irradiation with light... irradiation with laser light from the second substrate side of the laminate, to thereby debond the second substrate
Implementation Method 2
a film formed from a composition containing an adhesive component and a specific light-absorbing organic compound suitably serve as an adhesive layer which has excellent heat resistance during joining to a support (i.e., curing)
Data Source
AI summary
An adhesive composition for use in debonding with light irradiation, which composition can achieve debonding through irradiation with light, characterized in that the adhesive composition contains an adhesive component (S) and a light-absorbing organic compound (X); and the light-absorbing organic compound (X) contains, in the molecule thereof, one or more aromatic rings, one or more rings each containing a heteroatom forming the ring, and one or more groups selected from among a carbonyl group and a thiocarbonyl group.