Light Device Substrate Segmentation for Heat Management
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Solution Overview
Problem
Concentrated light sources on a substrate in existing light devices lead to heat influence issues, which are not effectively addressed.
Innovation Solution
The light device features independently spaced substrates with a column and partition portion, along with a housing and inner/outer lenses, where the substrates are supported and isolated to manage heat, and lens cut portions enhance light visibility and illumination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If multiple light sources are disposed on a single substrate in a concentrated manner, then the device complexity is reduced, but heat influence increases
Solution Approach 1:
The patent divides the substrate into multiple independent substrates (first substrate, second substrate, third substrate) that are spaced apart from each other. Each substrate carries light sources or electrical elements, and they are positioned at different locations (front, rear, and intermediate positions) to distribute heat generation across multiple separated components rather than concentrating them on a single substrate.
2Temperature
If light sources are spaced apart on multiple substrates, then heat influence is reduced, but device complexity increases
Solution Approach 1:
The patent combines multiple substrates onto a single support structure (column or housing). The first, second, and third substrates are all mounted on the same support, integrating their functions while maintaining spatial separation. This merging approach reduces overall device complexity by using a unified support structure rather than requiring separate mounting mechanisms for each substrate.
Solution Approach 2:
The support structure (column or housing) serves multiple functions: it provides mechanical support for all substrates, positions them at appropriate spacings, and facilitates heat dissipation. This multi-functional design reduces the need for additional specialized components, thereby managing device complexity while achieving heat separation.
3Object-affected harmful factors
If substrates are independently spaced with partition portions, then heat isolation is improved, but manufacturing complexity increases
Solution Approach 1:
The partition portions are integrated with the support structure (column or housing) rather than being separate components. The support structure itself forms the partitions that separate the substrates, combining the support function and the heat isolation function into a single manufactured piece. This reduces assembly steps and manufacturing complexity while maintaining effective heat isolation between substrates.
Data Source
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AI summary
To provide a light device that can suppress the heat influence. In a tail light 10 comprising LED chips 25, 26, an electronic component 27 that turns on the LED chips 25, 26, and a first substrate 15, and a second substrate 17, and a third substrate 19 on which the LED chips 25, 26 and the electronic component 27 are disposed, a plurality of the first substrate 15, the second substrate 17, and the third substrate 19 are independently provided, and are disposed to be spaced from one another.