Light Emitting Device Assembly for Split-Safe Transmissive Members
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Solution Overview
Problem
Existing methods of manufacturing light emitting devices are prone to splitting failures due to the bonding member being disposed at the splitting positions of the light transmissive member.
Innovation Solution
A method involving a structure with a metal layer covering light emitting parts, a protective member, and a light transmissive member bonded via a bonding member, where exposed portions are created using the metal layer as a mask to split the light transmissive member into individual pieces, reducing splitting failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the bonding member is disposed at the splitting positions of the light transmissive member, then the bonding strength is improved, but the light transmissive member becomes prone to splitting failures
Solution Approach 1:
The bonding member is segmented into multiple parts: a first bonding part disposed at the splitting position and a second bonding part disposed away from the splitting position. This segmentation allows the bonding function to be distributed, with the first bonding part providing bonding strength while the second bonding part avoiding the splitting position to prevent failures
Solution Approach 2:
Different portions of the bonding member are positioned at different locations relative to the splitting position. The first bonding part is locally positioned at the splitting position to provide bonding, while the second bonding part is locally positioned away from the splitting position to avoid causing splitting failures
2Reliability
If the bonding member is removed from splitting positions, then splitting failures are reduced, but bonding strength may be compromised
Solution Approach 1:
The bonding member is divided into multiple parts with different functions: the first bonding part at the splitting position provides bonding strength, while the second bonding part away from the splitting position provides additional bonding without causing splitting failures
Solution Approach 2:
The first bonding part acts as an intermediary that provides bonding at the splitting position without causing splitting failures, as it is specifically designed to bond the light transmissive member to the light emitting part while avoiding the harmful effects of complete removal
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces splitting failures and improves the reliability and efficiency of light emitting devices by using the metal layer as a mask to remove bonding member portions and enhance adhesion, while also improving light extraction efficiency and reducing voids and degradation.
Implementation Method 1
creating exposed portions of the light transmissive member exposed from the bonding member by removing portions of the bonding member, each located between adjacent ones of the light emitting parts, and the protective member using the metal layer as a mask
Implementation Method 2
bonding a light transmissive member to the lower surfaces of the light emitting parts via a bonding member
Implementation Method 3
irradiating a laser beam LL on locations of the exposed portions 72
Data Source
AI summary
A method of manufacturing a light emitting device includes: providing a structure including: a first substrate, a plurality of light emitting parts arranged apart from one another on an upper surface of the first substrate, a metal layer disposed on an upper surface side of the first substrate and covering at least the light emitting parts, and a protective member covering the metal layer; bonding a second substrate to the protective member; exposing the lower surfaces of the light emitting parts by removing the first substrate; bonding a light transmissive member to the lower surfaces of the light emitting parts via a bonding member; removing the second substrate; creating exposed portions of the light transmissive member; removing the metal layer; and dividing the light transmissive member into individual pieces at the exposed portions.