Light Emitting Element Bonding with Buffer Sheet Pressure Equalization
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Solution Overview
Problem
Existing light emitting devices face bonding strength variation issues when manufacturing multiple semiconductor elements on a single wiring substrate, leading to inefficiencies in production.
Innovation Solution
A method involving the use of first and second bonding parts on a wiring substrate, where a buffer sheet is applied to uniformly distribute pressure across the elements, allowing for multiple bonding cycles under different conditions to enhance bonding strength and reduce variation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a large number of semiconductor elements are bonded on a wiring substrate all at once, then production efficiency is increased, but bonding strength variation among the semiconductor elements increases
Solution Approach 1:
The bonding process is divided into multiple sequential stages: a first bonding stage that bonds semiconductor elements to a temporary substrate, and a second bonding stage that bonds the temporary substrate to the wiring substrate. This segmentation allows each stage to be optimized independently, reducing bonding strength variation while maintaining high production efficiency.
Solution Approach 2:
The semiconductor elements are preliminarily bonded to a temporary substrate under controlled conditions before being transferred to the wiring substrate. This preliminary action ensures uniform initial bonding, which reduces variation in the final bonding strength when elements are bonded to the wiring substrate in large numbers.
2Ease of manufacture
If bonding is performed under uniform conditions for all semiconductor elements, then manufacturing simplicity is maintained, but bonding strength variation increases due to positional differences
Solution Approach 1:
Different bonding conditions are applied to semiconductor elements based on their positions on the wiring substrate. Elements at different locations receive customized bonding parameters (such as temperature, pressure, or time variations) to compensate for positional differences, ensuring uniform bonding strength across all elements while maintaining manufacturing simplicity through automated condition adjustment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves a bonding strength ratio of standard deviation to average value of 0.1 or lower, ensuring consistent bonding across multiple light emitting elements, improving production efficiency and reliability.
Implementation Method 1
applying pressure on the plurality of first elements via the buffer sheet towards the wiring substrate
Data Source
AI summary
A method of manufacturing a light emitting device includes preparing a plurality of first elements including first bonding parts and a wiring substrate including a plurality of second bonding parts. The method further includes placing the first elements on the wiring substrate by bonding the first bonding parts and the second bonding parts under first bonding conditions, and bonding the first bonding parts and the second bonding parts under second bonding conditions by placing a buffer sheet on the first elements and applying pressure on the first elements via the buffer sheet towards the wiring substrate. The bonding conducted under the second bonding conditions is performed multiple times.