Light-Emitting Element Bonding With Self-Aligned Insulating Mask
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Solution Overview
Problem
Existing methods for manufacturing display devices face challenges in efficiently bonding light emitting elements, leading to potential defects and reduced process tolerance, which can affect the yield and performance of the display devices.
Innovation Solution
A method is employed where a light emitting element is used as a mask during the manufacturing process, involving the formation of an insulating layer, exposure, and development to expose electrode portions, allowing precise bonding of the light emitting element to the electrode, and enabling the use of additional elements for repair or overlapping areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional bonding methods are used for light emitting elements, then the bonding process can be completed, but process tolerance is reduced and defects may occur
Solution Approach 1:
The patent introduces a photosensitive insulating layer as an intermediary material between the light emitting element and the electrode. This layer serves as both a protective insulating layer and a bonding medium, allowing the light emitting element to be stably positioned and bonded to the electrode while preventing direct contact that could cause shorts or damage. The intermediary layer enables controlled exposure and bonding processes that improve both reliability and process tolerance.
2Manufacturing precision
If multiple masks are used in the manufacturing process, then precise positioning can be achieved, but the manufacturing process becomes complex
Solution Approach 1:
The photosensitive insulating layer performs multiple functions simultaneously: it acts as an insulating layer, a positioning mask, and a bonding medium. By making this single layer multi-functional, the patent eliminates the need for separate masks while maintaining precise positioning capability. The layer's photo-sensitive property allows it to serve as a self-aligned mask during the bonding process, reducing manufacturing complexity without sacrificing precision.
3Ease of manufacture
If light emitting elements are bonded directly to electrodes, then bonding can be achieved, but defects and yield reduction occur
Solution Approach 1:
The patent applies a photosensitive insulating layer beforehand as a protective cushioning layer before the bonding process. This layer prevents direct contact between the light emitting element and the electrode, cushioning against potential damage during positioning and bonding. The layer can be selectively removed or exposed in controlled areas, allowing safe bonding in designated regions while protecting other areas, thereby improving yield rate without compromising bonding ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances process tolerance, improves yield, simplifies the manufacturing process, and reduces the need for multiple masks, thereby ensuring reliable bonding and efficient production of display devices.
Implementation Method 1
light-exposing the insulating layer, exposing at least a portion of the first electrode by developing the insulating layer
Implementation Method 2
melting the first bonding electrode
Data Source
AI summary
In a method of manufacturing a display device, the method includes forming a first electrode on a substrate, forming an insulating layer over the first electrode, aligning a first light emitting element on the insulating layer, light-exposing the insulating layer, exposing at least a portion of the first electrode by developing the insulating layer, and bonding the first light emitting element to the at least a portion of the first electrode.