Light Emitting Element Insulation Structure for Stable Electrode Contact
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Solution Overview
Problem
Existing display devices face challenges in achieving efficient light emission and electrical stability due to issues with the structure and protection of light emitting elements.
Innovation Solution
A light emitting element is designed with a protective layer and an insulating film that encloses the outer circumferential surfaces of the semiconductor layers and electrode layers, while exposing specific surfaces for contact, and the protective layer is made of insulating material with a high etch rate for easy removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the light emitting element structure is simplified for ease of manufacture, then manufacturing precision and reliability may deteriorate due to insufficient protection and connection stability
Solution Approach 1:
The protective layer is divided into a body portion covering the outer circumferential surface and a protruding portion extending toward the electrode layer, creating distinct functional segments that simplify the overall structure while maintaining protection and connection stability
Solution Approach 2:
The protruding portion of the protective layer is formed in advance to protrude toward the electrode layer before final assembly, preliminarily establishing the connection path and reducing the complexity of subsequent manufacturing steps
2Reliability
If the protective layer thickness is increased for better protection, then manufacturing complexity and etching difficulty increase
Solution Approach 1:
The protective layer exhibits local quality variation with different thicknesses in different regions: the body portion has sufficient thickness for protection, while the protruding portion has reduced thickness for easier etching and electrode exposure, optimizing both protection and manufacturability
3Reliability
If the insulating film completely covers all surfaces for maximum protection, then electrical connection efficiency deteriorates due to inability to expose contact surfaces
Solution Approach 1:
The insulating film is selectively removed or not formed in specific regions where electrical connection is required, extracting the insulation function from areas where it would hinder connection efficiency while maintaining it in areas where protection is needed
4Reliability
If standard etching materials are used for the protective layer, then etching time and manufacturing cost increase
Solution Approach 1:
The protective layer is formed from materials with specific etching parameters (high etch rate) that differ from standard protective layer materials, changing the etching parameter to achieve faster removal and exposure of the electrode layer while maintaining material compatibility with the manufacturing process
Data Source
AI summary
A light emitting device may include a first semiconductor layer; an active layer disposed on the first semiconductor layer; a second semiconductor layer disposed on the active layer; an electrode layer disposed on the second semiconductor layer; a protective layer disposed on the electrode layer; and an insulating film enclosing outer circumferential surfaces of at least the first semiconductor layer, the active layer, the second semiconductor layer, and the electrode layer, and exposing a surface of the first semiconductor layer and a surface of the protective layer.