Light-Emitting Element Rod Formation to Reduce Threading Dislocations

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Solution Overview

Problem

Existing display devices face challenges in improving light emission efficiency due to threading dislocations in light-emitting elements.

Innovation Solution

A method of manufacturing light-emitting elements involves forming a base substrate with protrusions and a rod area, depositing semiconductor layers, using mask patterns to form element rods, and separating them from a buffer layer, thereby reducing threading dislocations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional manufacturing methods are used, then production process is simpler, but threading dislocations increase and light emission efficiency decreases

Engineering Contradiction:
Improvelight emission efficiencyVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The base substrate is pre-formed with protrusions and a rod area before growing the light-emitting elements. This preliminary structuring of the substrate creates designated growth zones that guide element formation and reduce threading dislocations from the outset, rather than attempting to fix defects after element creation.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The base substrate is divided into distinct regions: protrusions and a rod area. This segmentation creates separate functional zones where the rod area serves as a dislocation-free growth zone, isolating the light-emitting elements from defect-prone areas and enabling higher quality element formation.

Inventive Principle:
Principle #1Segmentation

2Productivity

If element rods are formed to overlap protrusions, then manufacturing is easier, but threading dislocations increase and functional yield decreases

Engineering Contradiction:
Improvefunctional element yieldVSAvoidalignment precision requirement
Core Design Contradiction:
ProductivityVSEase of manufacture

Solution Approach 1:

Different regions of the base substrate are assigned different qualities/functions: protrusions serve as structural features while the rod area provides a dislocation-free growth zone. By forming element rods specifically in the rod area rather than over protrusions, the method exploits local quality differences to achieve both ease of manufacture and high functional yield.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The rod area acts as an intermediary zone between the protrusions and the light-emitting elements. This intermediate region mediates the growth process by providing a buffer that prevents direct interaction between elements and protrusions, thereby reducing threading dislocations while maintaining manufacturing simplicity.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS12520627B2Method of manufacturing light-emitting element, and light-emitting element array substrate and display device including the same
Publication Date: 2026.01.06 SAMSUNG DISPLAY CO LTD
  • US12520627B2 patent drawing
  • US12520627B2 patent drawing
  • US12520627B2 patent drawing

AI summary

A method of manufacturing a light-emitting element, and a light-emitting element array substrate and a display device including the same are provided. A method of manufacturing a light-emitting element includes: forming a base substrate including a plurality of protrusions and a rod area which is a remaining area except for the plurality of protrusions; forming a buffer layer on the base substrate; forming a semiconductor structure including a first semiconductor material layer, a light-emitting material layer, and a second semiconductor material layer on the buffer layer; forming a plurality of mask patterns overlapping the rod area on the semiconductor structure; forming element rods by removing the semiconductor structure overlapping the plurality of protrusions using the plurality of mask patterns; forming an insulating film around an outer surface of each of the element rods. and separating the element rods from the buffer layer.