Light-Emitting Element Transfer With Laser-Shielding Release Layers
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Solution Overview
Problem
Existing light-emitting devices face challenges in achieving high reliability due to damage from laser irradiation during the manufacturing process and inefficient light extraction.
Innovation Solution
A method for manufacturing light-emitting devices involves preparing a first structure with a release layer and light-emitting elements, where the release layer is irradiated with laser light to transfer the elements to a second substrate, minimizing direct laser exposure and using a light attenuating layer to enhance light extraction efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser light is used to remove the release layer for transferring light-emitting elements, then the transfer efficiency is improved, but the light-emitting elements may be damaged by direct laser irradiation
Solution Approach 1:
The patent introduces a light attenuating layer positioned between the laser light source and the light-emitting elements. This intermediary layer selectively absorbs or scatters the laser light, protecting the light-emitting elements from direct irradiation damage while still allowing the laser to effectively remove the release layer for element transfer.
Solution Approach 2:
The light attenuating layer is strategically positioned and configured to provide localized protection only where needed - specifically in regions where light-emitting elements are present. This allows differential treatment: areas with elements receive protected laser exposure for gentle release layer removal, while other areas can undergo more aggressive processing.
2Reliability
If the release layer completely encloses the light-emitting element, then the element is well-protected during transfer, but laser light cannot effectively reach the release layer for removal
Solution Approach 1:
The light attenuating layer serves as a mediator that enables laser light to penetrate through or around the enclosing release layer structure. By positioning this layer strategically, the system achieves both complete enclosure for protection and effective laser access for release layer removal.
Solution Approach 2:
The solution addresses the enclosure problem by operating in multiple dimensions - the light attenuating layer may be positioned at different depths or angles relative to the release layer, allowing laser light to access the release layer from lateral or oblique directions while the release layer maintains its enclosing protective function.
3Device complexity
If conventional transfer methods are used without a light attenuating layer, then the manufacturing process is simpler, but light extraction efficiency is reduced and elements are damaged by laser irradiation
Solution Approach 1:
The light attenuating layer acts as a multifunctional intermediary that simultaneously protects light-emitting elements from laser damage and enhances light extraction efficiency. While it adds a structural element, the layer can be integrated into existing manufacturing workflows and provides dual benefits that offset the increased complexity.
Solution Approach 2:
The light attenuating layer performs multiple functions within a single component: (1) protects light-emitting elements from laser irradiation damage, (2) enhances light extraction efficiency from the elements, and (3) maintains structural integrity during the transfer process. This multi-functionality justifies the added complexity by delivering multiple performance improvements simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the reliability of light-emitting devices by reducing damage from laser irradiation and increasing light extraction efficiency through the strategic use of a release layer and light attenuating layer.
Implementation Method 1
the release layer is irradiated with laser light from a second surface side of the first substrate
Data Source
AI summary
A method for manufacturing a light-emitting device includes: preparing a first structure comprising: a first substrate having a first surface and a second surface on a side opposite the first surface, a release layer disposed on the first surface, and one or more light-emitting elements fixed to the first surface of the first substrate via the release layer, the one or more light-emitting elements each having a third surface facing the release layer and a fourth surface on a side opposite the third surface, the fourth surface being larger than the third surface in a plan view, wherein: the release layer encloses the fourth surface in the plan view; preparing a second structure comprising a second substrate having an upper surface; and transferring the one or more light-emitting elements from the first substrate to the second substrate by removing the release layer.