Light Emission Device Substrate Recesses for Thermal Management
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Solution Overview
Problem
Existing light emission devices face challenges in efficiently emitting light due to absorption of excitation and illumination light by the substrate and wavelength converter, leading to reduced light output and increased thermal resistance, which affects heat dissipation and device reliability.
Innovation Solution
A light emission device design featuring a substrate with recesses and projections that house a wavelength converter, allowing for improved adhesion and heat dissipation, along with a reflective film to minimize light absorption and enhance light emission efficiency, utilizing a light emission element and wavelength converter that convert excitation light into visible light, and a mount board for efficient illumination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate is filled with resin to seal the light emission element, then the light emission element is protected and sealed, but light absorption by the substrate and wavelength converter increases, reducing light output
Solution Approach 1:
The patent extracts the wavelength converter from the resin-filled space and positions it directly on the substrate surface. This removes the harmful absorption path through the resin while maintaining the sealing function through the substrate structure itself, thereby improving light output while preserving protection.
Solution Approach 2:
The patent introduces a reflective film as an intermediary between the light emission element and the substrate. This reflective film reduces light absorption by the substrate and wavelength converter, allowing more light to escape while maintaining the sealing structure.
2Illumination intensity
If the wavelength converter is positioned on the substrate surface, then light absorption is reduced and light output improves, but adhesion strength may be insufficient
Solution Approach 1:
The patent creates a recess in the substrate surface to position the wavelength converter. This dimensional change provides mechanical interlocking and increased surface area for adhesion, ensuring strong bonding while maintaining the wavelength converter's position for optimal light output.
Solution Approach 2:
The wavelength converter is nested within a recess in the substrate, creating a hierarchical structure where the converter is positioned in a cavity. This nesting provides both secure adhesion through the recess walls and optimal optical positioning for light emission.
3Temperature
If the substrate absorbs heat from the light emission element, then thermal management occurs, but thermal resistance increases affecting device reliability
Solution Approach 1:
The patent extracts the wavelength converter from the resin-filled space and positions it directly on the substrate with thermal contact. This removes the thermal resistance barrier provided by the resin, improving heat dissipation from the light emission element while maintaining device reliability through effective thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances light emission efficiency by reducing absorption, improving heat dissipation, and maintaining device reliability through strong adhesion of the wavelength converter, resulting in effective light output and thermal management.
Implementation Method 1
The wavelength converter converts the excitation light into illumination light
Data Source
AI summary
A light emission device includes a substrate, a light emission element, and a wavelength converter. The substrate has a first surface. The light emission element is mounted on the first surface and emits excitation light. The wavelength converter is positioned on at least a portion of the first surface and the light emission element. The wavelength converter converts the excitation light into illumination light. The substrate includes at least one of a recess or a projection. The recess has a second surface and a third surface. The second surface is positioned below the first surface. The third surface connects the second surface and the first surface to each other. The projection projects upward from the first surface. The wavelength converter is in contact with at least one of at least a portion of the second surface or at least a portion of the projection.