Semiconductor Light Emitter Housing Bonding for Lower Internal Resistance
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Solution Overview
Problem
Semiconductor light emitting devices face challenges in improving internal resistance, which affects the efficiency and reliability of semiconductor laser elements due to limitations in manufacturing methods and material constraints.
Innovation Solution
The semiconductor light emitting device incorporates a wiring structure and an electrically conductive bonding section that increases the cross-sectional area of the wiring line, bonding the housing members and electrically coupling the light emitting element to the outside, thereby reducing internal resistance and enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional wiring structures are used in housing members, then device complexity is reduced, but internal resistance increases and heat dissipation deteriorates
Solution Approach 1:
The patent merges the bonding function and electrical conduction function into a single electrically conductive bonding section. This bonding section simultaneously bonds the first and second housing members together and provides an electrical conduction path between them, eliminating the need for separate wiring structures within the housing members. The merging of these functions reduces device complexity while improving internal resistance and heat dissipation.
Solution Approach 2:
The electrically conductive bonding section serves multiple functions: it acts as a structural bonding element to join housing members, provides an electrical conduction path for current flow, and functions as a heat dissipation pathway. This multi-functionality allows the device to achieve lower internal resistance without adding complex wiring structures, as the bonding section itself performs all three roles.
2Reliability
If wiring structures are added to housing members to improve electrical conduction, then internal resistance decreases, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines the bonding operation and electrical conduction path formation into a single manufacturing step. The electrically conductive bonding section is applied during the bonding process itself, eliminating the need for subsequent wiring installation steps. This merging of operations simplifies manufacturing while achieving low internal resistance and high electrical conduction efficiency.
Solution Approach 2:
The bonding section serves itself by providing both mechanical bonding and electrical conduction functions. During the bonding process, the electrically conductive bonding section automatically creates the electrical connection between housing members without requiring additional wiring steps. This self-service approach reduces manufacturing complexity while maintaining excellent electrical conduction properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces internal resistance, improves heat dissipation, and increases the reliability and efficiency of the semiconductor light emitting device by using the bonding member as an electrical conduction path, effectively addressing the limitations of existing technologies.
Implementation Method 1
The electrically conductive bonding section is electrically coupled to the wiring structure. The electrically conductive bonding section bonds the first housing member and the second housing member.
Implementation Method 2
The electrically conductive bonding section is electrically coupled to the wiring structure provided in at least one of the first housing member or the second housing section, thereby increasing the cross-sectional area of a wiring line that electrically couples the light emitting element and the outside
Data Source
AI summary
There is provided a semiconductor light emitting device that allows the internal resistance to be improved. A semiconductor light emitting device according to an embodiment of the present disclosure includes: a light emitting element; a first housing member and a second housing member at least one of which has a wiring structure; and an electrically conductive bonding section. The first housing member and the second housing member house the light emitting element. The wiring structure electrically couples the light emitting element and an outside. The electrically conductive bonding section bonds the first housing member and the second housing member. The electrically conductive bonding section is electrically coupled to the wiring structure.