Multi-Level Light Emitter Base for Wire Bonding Alignment
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Solution Overview
Problem
Existing light emitting devices face challenges in facilitating efficient wire bonding between light emitting elements and electronic members due to complex geometries and varying heights of bonding positions.
Innovation Solution
The light emitting device incorporates a base with stepped portions of different heights, allowing for the strategic placement of wiring regions and wire bonding positions to simplify the connection process between light emitting elements and electronic members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a single-level base structure is used for wire bonding, then the device structure is simple, but the wire bonding process becomes difficult due to varying heights of bonding positions
Solution Approach 1:
The base is divided into multiple stepped portions at different heights. The first stepped portion is positioned at a first height for bonding light emitting elements, while the second stepped portion is positioned at a second height for bonding electronic members. This segmentation allows wire bonding to be performed at different elevation levels, making the bonding process easier without requiring complex positioning mechanisms.
Solution Approach 2:
The base structure transitions from a single-plane (2D) configuration to a multi-level (3D) stepped configuration. By utilizing vertical dimensionality with stepped portions at different heights, the patent creates distinct bonding zones that are spatially separated in the vertical direction, thereby facilitating wire bonding operations without increasing horizontal complexity.
2Ease of manufacture
If wiring regions are placed at different heights, then wire bonding is facilitated, but the base structure becomes more complex
Solution Approach 1:
The base is segmented into distinct functional zones: a first wiring region on the first stepped portion for light emitting element connections, and a second wiring region on the second stepped portion for electronic member connections. This segmentation allows each wiring region to be optimized for its specific bonding requirements, simplifying the manufacturing process while maintaining structured organization.
Solution Approach 2:
Different regions of the base are given different local characteristics through the stepped structure. The first stepped portion provides a bonding surface optimized for light emitting elements, while the second stepped portion provides a bonding surface optimized for electronic members. Each local region has the appropriate height and configuration for its specific bonding requirements.
Data Source
AI summary
A base includes: a bottom part having a bottom face; and a lateral part surrounding the bottom face and extending upwards from the bottom face, the lateral part having an uppermost face and comprises a first stepped portion including a first upper face and a second stepped portion including a second upper face, the first upper face and the second upper face being disposed below the uppermost face, and a height of the first stepped portion from the bottom face being different from a height of the second stepped portion from the bottom face. In a top view: the first upper face and the second upper face are disposed inward of the uppermost face, the bottom face is directly adjacent to the first upper face, the bottom face is directly adjacent to the second upper face, and the first upper face is directly adjacent to the second upper face.