Semiconductor Light Emitter Cap Bonding for Heat Dissipation
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Solution Overview
Problem
Existing semiconductor light emitting devices face challenges in efficiently dissipating heat and securely bonding the cap to the substrate, which can lead to temperature increases and potential structural weaknesses.
Innovation Solution
The semiconductor light emitting device employs a substrate made from materials like glass epoxy resin or ceramic, with a submount substrate and through interconnects for heat dissipation, and uses an adhesive bonding method involving an adhesion pattern and cap structure to ensure secure attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive is used to bond the cap to the substrate, then the bonding strength is improved, but the heat dissipation efficiency deteriorates
Solution Approach 1:
The bonding interface is segmented into multiple discrete bonding regions distributed across the cap-substrate interface, rather than using a continuous adhesive layer. This segmentation allows heat to bypass the adhesive through multiple thermal pathways while maintaining bonding strength through distributed bonding points.
Solution Approach 2:
A reflective layer is introduced as an intermediary between the adhesive and the substrate. This reflective layer serves dual functions: it enhances bonding by providing a bonding surface and improves heat dissipation by reflecting thermal energy away from the adhesive region, reducing thermal resistance at the bonding interface.
2Reliability
If the adhesive bonding area is increased, then the bonding reliability is improved, but the heat accumulation increases
Solution Approach 1:
The bonding structure exhibits local quality variations through the reflective layer, which creates regions of enhanced thermal reflection at the bonding interface. This local modification allows the adhesive to maintain reliable bonding while the reflective properties locally redirect heat flow, preventing heat accumulation despite increased bonding area.
3Ease of manufacture
If conventional adhesive bonding is used, then the manufacturing simplicity is maintained, but the structural integrity under thermal stress deteriorates
Solution Approach 1:
The reflective layer acts as a thermal management intermediary that protects the adhesive bonding from thermal degradation. By reflecting thermal energy away from the adhesive, this intermediary layer preserves the structural integrity of the bonding interface under thermal stress while adding minimal manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively dissipates heat and securely bonds the cap to the substrate, preventing excessive temperature rise and enhancing structural integrity.
Implementation Method 1
an adhesive bonding method involving an adhesion pattern and cap structure to ensure secure attachment
Data Source
AI summary
A semiconductor light emitting device is provided with: a substrate; an end surface emitting element that is mounted on the substrate; a cap that houses the end surface emitting element; and an adhesive that bonds the cap and the substrate to each other. The substrate is provided with a substrate through hole at a position where the substrate overlaps with the adhesive in a plan view. The semiconductor light emitting device comprises a bonding pattern that is formed on the substrate so as to surround the end surface emitting element in a plan view. The adhesive is provided on the bonding pattern and bonds the bonding pattern and the cap to each other. A pattern through hole, which is in communication with the substrate through hole, is formed in the bonding pattern. Some of the adhesive is in the pattern through hole.