Semiconductor Light Emitter Layout With Common Conductor to Cut Capacitance

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Solution Overview

Problem

Existing semiconductor light emitting devices experience parasitic capacitance due to separate electrical connections with electronic components using wires, which affects performance.

Innovation Solution

A semiconductor light emitting device design that integrates a semiconductor light emitting element and an electronic component on a common conductive portion on a substrate, reducing the conductive path length and parasitic capacitance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the electronic component is arranged separately from the semiconductor light emitting device and electrically connected by a wire, then the device structure is simple and easy to manufacture, but parasitic capacitance is increased due to the wire

Engineering Contradiction:

Improveease of manufactureVSAvoidparasitic capacitance

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent merges the electronic component with the semiconductor light emitting device by mounting both on a common substrate with shared conductive portions. This integration eliminates the need for separate wire connections, thereby reducing parasitic capacitance while maintaining ease of manufacture through a unified mounting process

Inventive Principle:

Principle #5Merging (Combining)

2Adaptability or versatility

If the conductive path between the semiconductor light emitting element and the electronic component is lengthened, then the device structure becomes more flexible, but parasitic capacitance is increased

Engineering Contradiction:

Improvestructural flexibilityVSAvoidparasitic capacitance

Core Design Contradiction:

Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The patent reduces the conductive path length by changing the spatial arrangement from a wire-based three-dimensional connection to a planar two-dimensional layout on the substrate. This dimensional change allows both components to be electrically connected with minimal path length while maintaining structural flexibility through layout design

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Ease of operation

If the wire connection is used to electrically connect the electronic component, then the device can be assembled easily, but the parasitic capacitance caused by the wire increases

Engineering Contradiction:

Improveassembly easeVSAvoidparasitic capacitance

Core Design Contradiction:

Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The patent combines the electrical connection function with the mounting structure by using the substrate's conductive portions as both the mechanical support and the electrical interconnect. This eliminates the separate wire component while maintaining easy assembly through a single mounting operation

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS12413044B2Semiconductor light emitting device

Publication Date: 2025.09.09 ROHM CO LTD

AI summary

A semiconductor light emitting device includes a substrate, a common conductive portion formed on the substrate, a semiconductor light emitting element mounted on the common conductive portion, and an electronic component mounted on the common conductive portion and electrically connected to the semiconductor light emitting element by the common conductive portion. This structure shortens the conductive path between the semiconductor light emitting element and the electronic component, thereby reducing capacitance caused by the conductive path between the semiconductor light emitting element and the electronic component. Thus, while reducing parasitic capacitance, the semiconductor light emitting element and the electronic component are electrically connected.