Light Emitter Cover Sealing With Encircling Step

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Solution Overview

Problem

Existing light emitter covers face challenges in achieving reliable sealing between a glass plate and a frame while maintaining a reduced size, as excessive low melting glass is required for effective bonding, but reducing the quantity leads to incomplete wetting and compromised sealing reliability.

Innovation Solution

The design incorporates a frame with an encircling step featuring a placement face and wall faces, including first wall faces that extend perpendicularly and a second wall face with a smaller inclination angle, ensuring the entire peripheral side surface of the glass plate is wetted by low melting glass for improved sealing, even with reduced glass usage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a large quantity of low melting glass is used to wet the entire peripheral side surface of the glass plate, then sealing reliability is improved, but the size of the light emitter cover increases

Engineering Contradiction:
Improvesealing reliabilityVSAvoidsize of light emitter cover
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The frame is designed with an encircling step that creates a localized gap between the glass plate peripheral side surface and the frame inner wall face. This step structure concentrates the low melting glass application to a specific region, ensuring complete wetting of the glass plate surface while using a reduced quantity of glass material, thus resolving the contradiction between sealing reliability and device size

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The encircling step is pre-formed on the frame before the low melting glass is applied. This preliminary structural preparation creates a predetermined gap that guides the low melting glass to automatically wet the entire peripheral side surface of the glass plate during the bonding process, eliminating the need for excessive glass material and reducing the overall cover size

Inventive Principle:
Principle #10Preliminary action

2Volume of moving object

If the quantity of low melting glass is reduced to facilitate size reduction, then the size of the light emitter cover decreases, but sealing reliability is lowered due to failure to wet the entire peripheral side surface

Engineering Contradiction:
Improvesize of light emitter coverVSAvoidsealing reliability
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The encircling step creates a localized gap structure that efficiently distributes a small quantity of low melting glass across the entire peripheral side surface of the glass plate. This localized gap design ensures complete surface wetting with minimal glass material, achieving both size reduction and maintained sealing reliability

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The encircling step structure is pre-formed on the frame to create a predetermined gap geometry. This preliminary action ensures that when low melting glass is applied, it automatically spreads to wet the entire glass plate peripheral side surface, achieving reliable sealing with reduced glass quantity and smaller device size

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances sealing reliability between the glass plate and the frame, preventing cracks from thermal impacts and facilitating size reduction of the light emitter cover without compromising sealing integrity.

Implementation Method 1

the low melting glass wets the entire peripheral side surface of the glass plate

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 2

a light emitter cover having a glass plate sealed to a frame via low melting glass

Methodology Applied
Scientific EffectSoldering: Soldering

Data Source

PatentEP3407395B1Cover for light emitter
Publication Date: 2019.10.09 SHINKO ELECTRIC IND CO LTD
  • EP3407395B1 patent drawingFigure 1A
  • EP3407395B1 patent drawingFigure 1B~1C
  • EP3407395B1 patent drawingFigure 2

AI summary

A cover for a light emitter having one or more light emitting devices includes a glass plate, a frame made of metal having an opening smaller than the glass plate, and a low melting glass having a lower melting point than the glass plate, the glass plate being sealed to the frame with the low melting glass to close the opening, wherein the frame has an encircling step, and the encircling step includes a placement face situated at a recessed position relative to an upper surface of the frame and a wall face, wherein the wall face includes first wall faces situated at opposite ends of each inner side of the encircling step and a second wall face situated between the first wall faces, and the second wall face includes a face extending at a smaller inclination angle than the first wall faces with respect to the placement face.