Organic Light Emitter Housing With Flexible PCB Interconnect

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Solution Overview

Problem

Existing light emitters lack a design that effectively protects internal components from external influences while maintaining a slim form factor and aesthetic appeal, and they often require complex electrical connections that can be cumbersome.

Innovation Solution

A light emitter design featuring a housing part with a receptacle for the radiation-generating device, a cover part joined to the housing, and a flexible printed circuit board for connecting electrical contacts of the same polarity to a common external terminal, allowing for a compact, aesthetically pleasing form with simplified electrical connections and effective heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional light emitter design is used, then the basic lighting function is achieved, but the device lacks effective protection of internal components while maintaining a slim form factor and aesthetic appeal

Engineering Contradiction:
Improveprotection of internal componentsVSAvoidform factor thickness
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The patent implements nesting by placing the optoelectronic device inside a receptacle formed within the housing part, and further nesting the heat-conducting element between the device and the cover part. This nested arrangement allows multiple functional components to be integrated in a compact, space-efficient manner that provides protection while maintaining a slim overall form factor.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent employs thin-film encapsulation layers on the optoelectronic device to provide protection against external influences. These thin protective films enable component protection without adding significant thickness, thus maintaining the slim form factor while improving reliability.

Inventive Principle:
Principle #30Flexible shells and thin films

2Adaptability or versatility

If multiple electrical contacts are used in the optoelectronic device, then functional requirements are met, but the electrical connections become complex and cumbersome

Engineering Contradiction:
Improveelectrical connection functionalityVSAvoidelectrical connection complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent merges multiple electrical contacts of the same polarity into a single common external electrical terminal part through the flexible printed circuit board. This consolidation reduces the number of separate connection points required, simplifying the electrical interface while maintaining the functional capability to connect all necessary contacts.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The flexible printed circuit board serves multiple functions simultaneously: it provides electrical connections for multiple contacts, enables mechanical mounting of the device, and allows for flexible routing. This multi-functionality reduces overall system complexity while maintaining comprehensive electrical connectivity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If internal components are protected from external influences, then reliability is improved, but the device structure becomes more complex

Engineering Contradiction:
Improveprotection from external influencesVSAvoidstructural complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The cover part is designed to perform multiple functions simultaneously: it provides mechanical protection for internal components, serves as a thermal management interface through the heat-conducting element, and contributes to the overall structural integrity. This multi-functionality achieves comprehensive protection without proportionally increasing structural complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

Thin protective encapsulation films are applied to the optoelectronic device to provide environmental protection. These thin films add minimal structural complexity while effectively protecting against moisture, oxygen, and other external influences, thus improving reliability without significantly complicating the device structure.

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design provides a compact, aesthetically enhanced light emitter that protects internal components, simplifies electrical connections, and efficiently dissipates heat, enhancing the device's reliability and user experience.

Implementation Method 1

the contacts of the same polarity connects via a connecting conductor of a conductor part to a common external electrical terminal part

Methodology Applied
Scientific EffectElectrical Conduction: Conduction (electrical)

Implementation Method 2

the cover part (4) has a thermal contact element (16) which is in heat-conducting manner connected with the heat-conducting element (19)

Methodology Applied
Scientific EffectThermal Conduction: Conduction (thermal)

Data Source

PatentUS9341361B2Light-emitting means and use
Publication Date: 2016.05.17 DOLYA HOLDCO 5 LTD
  • US9341361B2 patent drawing
  • US9341361B2 patent drawing
  • US9341361B2 patent drawing

AI summary

A light emitter with a radiation exit surface including a housing part with a receptacle, at least one organic optoelectronic device, arranged in the receptacle, and at least one cover part joined to the housing part, wherein the device is mounted between the cover part and the housing part.