Light Emitter Heat Conductor Layout for Thermal Stress Relief
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Solution Overview
Problem
Existing light emitting devices face challenges in efficiently dissipating heat, leading to potential damage and reduced reliability due to thermal stress, and there is a need for improved thermal dissipation characteristics.
Innovation Solution
A light emitting device design featuring a heat conductor unit with a heat-dissipation heat conductor that covers a larger area than the light emitter arrangement region, combined with a support substrate and insulators to enhance heat dissipation, and a structured arrangement of upper heat conductors to manage thermal distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional heat conductor design is used with area equal to or smaller than the light emitter arrangement region, then the device structure remains compact, but heat dissipation efficiency is insufficient leading to thermal stress and potential damage
Solution Approach 1:
The heat-dissipation heat conductor extends beyond the light emitter arrangement region in the plan view, utilizing the lateral dimension to increase heat dissipation area. This dimensional extension allows heat to be dissipated over a larger surface area without increasing the vertical profile or compromising device compactness, directly resolving the contradiction between heat dissipation efficiency and device complexity.
Solution Approach 2:
The heat conductor unit is segmented into distinct functional regions: a heat-dissipation heat conductor with area larger than the light emitter arrangement region for thermal management, and a support substrate for structural integrity. This segmentation allows each component to be optimized for its specific function, enabling improved heat dissipation without compromising overall device stability.
2Temperature
If the heat-dissipation heat conductor area is increased to improve heat dissipation, then thermal stress is reduced, but the structural stability may be compromised
Solution Approach 1:
The heat conductor unit employs a composite structure combining a heat-dissipation heat conductor material optimized for thermal conductivity with a support substrate material providing mechanical strength and stability. This composite approach allows the heat-dissipation region to extend beyond the light emitter arrangement region for improved thermal management while the support substrate maintains structural integrity, simultaneously addressing both thermal stress reduction and structural stability requirements.
3Reliability
If a larger heat-dissipation heat conductor is used, then heat dissipation efficiency improves, but the manufacturing complexity increases
Solution Approach 1:
The heat-dissipation heat conductor serves multiple functions: it provides thermal management by extending beyond the light emitter arrangement region to dissipate heat efficiently, and simultaneously serves as part of the structural support system. This multi-functionality reduces the need for separate dedicated heat sink components, thereby simplifying the overall manufacturing process while maintaining improved heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves heat dissipation efficiency, enhances structural stability, and increases the reliability of the light emitting device by effectively managing thermal stress and maintaining a stable structure.
Implementation Method 1
a heat-dissipation heat conductor configured to dissipate heat generated from the plurality of light emitters
Data Source
AI summary
Provided is a light emitting device including: a plurality of light emitters including semiconductor layers; and a heat conductor unit that provides a light emitter arrangement region in which the plurality of light emitters are arranged, in which the heat conductor unit includes a heat-dissipation heat conductor for dissipating heat generated from the plurality of light emitters, and an area of the heat-dissipation heat conductor, in a plan view, is larger than an area of the light emitter arrangement region.