Light Emitter Packages With Reflective Trenches
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Solution Overview
Problem
Current light emitter packages are costly and inefficient, lacking in brightness and light extraction, which hinders their adoption as cost-effective alternatives to traditional lighting solutions.
Innovation Solution
The development of light emitter packages that incorporate novel LED chips, optimized chip-to-chip spacing, exposed metallic traces, and reflective materials within trenches to enhance light reflection and extraction, along with optical conversion materials for improved brightness and color consistency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional LED packages are used, then manufacturing cost is reduced, but brightness and light extraction efficiency deteriorate
Solution Approach 1:
The package structure is segmented into multiple functional zones: LED chips mounted on a submount, trenches filled with reflective material positioned between chips, and optical conversion material applied to specific areas. This segmentation allows each component to optimize light extraction independently, achieving higher overall brightness without proportionally increasing manufacturing complexity
Solution Approach 2:
The invention adds vertical dimensionality by stacking multiple LED chips and reflective material layers within the package. The trenches extend vertically between chips, creating a three-dimensional light extraction pathway that increases total lumens per Watt without significantly increasing the package footprint or manufacturing steps
2Illumination intensity
If more LED chips are used to increase brightness, then illumination intensity improves, but manufacturing cost increases
Solution Approach 1:
The invention converts the potentially harmful effect of light absorption between adjacent chips into a benefit by filling the spaces between chips with reflective material. This reflective material redirects light that would otherwise be absorbed back toward the output, effectively increasing the utility of each chip's light output and reducing the total number of chips needed to achieve target brightness
Solution Approach 2:
The invention changes the optical parameters of the package by introducing reflective material with high reflectivity in the visible spectrum and optical conversion material with specific emission characteristics. These parameter changes allow fewer chips to produce the same total luminous flux, as each chip's contribution is amplified by the reflective and conversion materials surrounding it
3Loss of energy
If reflective material is added to enhance light extraction, then light extraction efficiency improves, but device complexity increases
Solution Approach 1:
The invention merges multiple functions into the trench structure: it serves as a mechanical spacer between chips, a pathway for light extraction, and a container for reflective material. By combining these functions into a single structural element, the package complexity increases minimally while light extraction efficiency improves significantly
Solution Approach 2:
The trenches serve multiple purposes simultaneously: they provide physical separation between LED chips to prevent heat buildup, create optical pathways for light extraction, and hold reflective material to redirect light. This multi-functionality reduces the need for additional separate components, keeping the overall device complexity manageable while achieving superior light extraction
4Manufacturing precision
If optical conversion material is used to improve color consistency, then color rendering index improves, but manufacturing cost increases
Solution Approach 1:
The optical conversion material is applied locally to specific areas of the package rather than uniformly across all surfaces. By positioning the conversion material in strategic locations where it can most effectively modify the combined light output of multiple chips, the manufacturing process is simplified and material costs are reduced while maintaining high color consistency
Solution Approach 2:
The package uses composite material structures combining LED chip materials, reflective material with specific reflectivity characteristics, and optical conversion material with tailored emission spectra. These composite materials work together to produce consistent color output across multiple chips, reducing the need for expensive individual chip selection and sorting processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These packages achieve higher lumens per Watt (up to 200 LPW) with improved color rendering index and consistency, reducing manufacturing costs and energy consumption while offering superior optical control and efficiency.
Implementation Method 1
reflective materials within trenches to enhance light reflection and extraction
Implementation Method 2
optical conversion materials for improved brightness and color consistency
Data Source
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Figure 1B
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AI summary
Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A first light emitter chip can mounted over at least a portion of the cathode, and a second light emitter chip can be wirebonded to at least a portion of the anode. Multiple light emitter chips can be disposed between the first and second light emitter chips.