Multi-Level Light Emitter Base for Separate Wire Bonding Paths
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Solution Overview
Problem
Existing light emitting devices face challenges in facilitating wire bonding between light emitting elements and electronic members due to the complexity of their structural configurations, which hinders efficient electrical connections.
Innovation Solution
The design incorporates a base with stepped portions of different heights, where the first stepped portion is used for wire bonding with semiconductor laser elements and the second stepped portion is used for wire bonding with the electronic member, allowing for distinct bonding positions that simplify the connection process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a single-level base structure is used for mounting light emitting elements and electronic members, then the device structure is simple, but wire bonding becomes difficult and time-consuming
Solution Approach 1:
The base structure is segmented into multiple stepped portions at different heights. The first stepped portion is dedicated to mounting light emitting elements while the second stepped portion is dedicated to mounting electronic members. This segmentation allows wires to be routed and bonded more easily between components at different elevations, resolving the wire bonding difficulty without requiring an overly complex overall structure.
Solution Approach 2:
The invention transitions from a single-plane mounting structure to a multi-level three-dimensional structure. By creating stepped portions at different heights, the base provides vertical separation between light emitting elements and electronic members, enabling more straightforward wire routing and bonding operations while maintaining structural integrity.
2Productivity
If multiple components are mounted on the same level of the base, then the base structure remains simple, but the time required for wire bonding increases
Solution Approach 1:
The base is divided into distinct functional zones through stepped portions. The first stepped portion accommodates light emitting elements and the second stepped portion accommodates electronic members. This zonal segmentation allows wire bonding operations to be performed more efficiently by providing accessible bonding surfaces at optimized heights, reducing the time required for connections.
Solution Approach 2:
Different regions of the base are given different heights and functional characteristics. The first stepped portion is optimized for light emitting element mounting with appropriate height for wire bonding, while the second stepped portion is optimized for electronic member mounting. This local differentiation improves wire bonding efficiency without requiring complete structural redesign.
Data Source
AI summary
A light emitting device includes: a base having a bottom face and a lateral part surrounding the bottom face and extending upwards from the bottom face, wherein the lateral part has an uppermost face and includes a first stepped portion including a first upper face and a second stepped portion including a second upper face, wherein the first upper face and the second upper face are disposed below the uppermost face, wherein the first upper face and the second upper face are disposed inward of the uppermost face in a top view, and wherein a height of the first stepped portion from the bottom face is lower than a height of the second stepped portion from the bottom face; a semiconductor laser element disposed on the bottom face; and a light reflective member and/or an optical member disposed on the bottom face.