Light-Emitting Array Module With Thin Connection Portions
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Solution Overview
Problem
Full-color LED displays suffer from decreased color resolution due to the inability of light beams from each LED group to form a single point light source, resulting in halation between adjacent groups caused by unseparated encapsulation layers.
Innovation Solution
A light-emitting array module design featuring a circuit substrate with light-emitting groups arranged in a matrix, encapsulated by an encapsulation body with thin connection portions that separate adjacent encapsulation portions, forming a curved chamfer to direct light beams into a single point source, increasing color resolution and light-emitting angle.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If an unseparated overall encapsulation layer or strip-shaped encapsulation layer is used, then the manufacturing process is simple, but halation occurs between adjacent LED groups and color resolution decreases
Solution Approach 1:
The encapsulation body is divided into multiple encapsulation portions, each corresponding to a light-emitting group, separated by thin connection portions. This segmentation prevents light from adjacent groups from mixing, eliminating halation and improving color resolution while maintaining structural integrity through the connecting portions.
2Device complexity
If an unseparated encapsulation layer is used, then the device structure is simple, but light beams cannot be transformed into a single point light source
Solution Approach 1:
The encapsulation body has different thicknesses in different regions: thicker encapsulation portions for light emission and thinner connection portions for separation. This local variation in thickness enables light beams to converge into a single point source while maintaining the simplicity of the overall structure.
3Manufacturing precision
If thin connection portions are introduced to separate encapsulation portions, then color resolution is improved, but the encapsulation body becomes more complex
Solution Approach 1:
Multiple encapsulation portions are merged into a single integrated encapsulation body connected by thin connection portions. This merging approach maintains structural integrity and simplifies manufacturing while achieving the separation effect needed for high color resolution, as the entire structure can be produced as one piece.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively transforms light beams into an obvious single point source, enhancing color resolution and light-emitting angle, thereby improving the overall performance of the LED display.
Implementation Method 1
light beams generated by the light-emitting group can be transformed into an obvious single point light source without halation due to the design of 'each thin connection portion being connected between the two adjacent encapsulation portions'
Data Source
AI summary
A light-emitting array module includes a circuit substrate, a light-emitting unit, and an encapsulation body. The light-emitting unit includes a plurality of light-emitting groups arranged in matrix on the circuit substrate. The encapsulation body disposed on the circuit substrate for encapsulating the light-emitting groups. The encapsulation body includes a plurality of encapsulation portions and a plurality of thin connection portions. Therefore, light beams generated by the light-emitting group is transformed into an obvious single point light source without halation due to the design of “each thin connection portion connected between the two adjacent encapsulation portions to separate the two adjacent encapsulation portions from each other by a predetermined distance”, so that the color resolution of the light-emitting array module is increased. In addition, the present disclosure further provides a display device including the light-emitting array module.