Light Emitting Assembly Segmentation for Optical Module Yield
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Solution Overview
Problem
The conventional packaging methods for high-speed optical modules face challenges in miniaturization and signal yield due to increased complexity and signal loss, particularly with the need for more optical wavelength division multiplexers and longer flexible circuit boards, which affect assembly and manufacturing processes.
Innovation Solution
A two-section structure is adopted, separating the LD chip component from the optical wavelength division multiplexer, allowing for two-step optical signal processing, and utilizing a gold welding wire and optical fiber adapter set to reduce impedance discontinuity and assembly stress, respectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If more optical wavelength division multiplexers are integrated to increase channel density, then the number of channels increases, but the device complexity increases and manufacturing yield decreases
Solution Approach 1:
The optical module is divided into independent functional sections: a first section containing the LD chip and first MUX, and a second section containing the second MUX. This segmentation allows each section to be manufactured and tested separately, improving yield while enabling high channel density through parallel operation of multiple wavelength multiplexers.
2Ease of operation
If FPC is used to electrically connect LD chip to PCB, then assembly flexibility is improved, but signal loss increases due to longer length and impedance discontinuities
Solution Approach 1:
The FPC and its associated solder pads are extracted from the signal path between the LD chip and PCB. Instead, the LD chip is directly mounted on the PCB with optimized pad design, eliminating the FPC's impedance discontinuities and reducing signal loss while maintaining assembly flexibility through direct mounting.
3Ease of operation
If FPC is used for electrical connection, then assembly tolerance compensation is improved, but PCB space occupation increases due to larger pad design
Solution Approach 1:
A flexible adhesive layer is introduced between the LD chip and PCB to provide assembly tolerance compensation. This thin flexible film replaces the bulky FPC structure, maintaining the ability to accommodate assembly variations while dramatically reducing PCB space occupation and eliminating impedance discontinuities.
4Volume of stationary object
If conventional packaging method is used for miniaturization, then packaging size is reduced, but manufacturing yield decreases due to excessive devices and intensive mounting
Solution Approach 1:
The optical module is segmented into independent functional sections that can be manufactured and tested separately before final assembly. This segmentation reduces the complexity of intensive mounting operations, improves manufacturing yield, and enables miniaturization through efficient space utilization in each section.
Solution Approach 2:
The LD chip and MUX components are pre-assembled and pre-tested in their respective sections before final integration into the compact housing. This preliminary action allows for quality control at intermediate stages, improving overall manufacturing yield while enabling the final miniaturized packaging.
Data Source
AI summary
The present invention relates to the technical field of optical communication, and provides a light emitting assembly comprising: an LD chip component, an optical wavelength division multiplexer, a first package housing and a second package housing; the first package housing is fixedly connected with the second package housing to form a first chamber for packaging the LD chip component and a second chamber for packaging the optical wavelength division multiplexer, the first chamber is located inside the first package housing, and the second chamber is located inside the second package housing. The present invention also provides an optical module comprising: a housing, a light receiving assembly and the light emitting assembly mentioned above, wherein the light receiving assembly and the light emitting assembly are both disposed on the housing. The present invention adopts a two-section structure, so that the LD chip component and the optical wavelength division multiplexer are independently separated, and the optical signal processing is carried out in two steps, which not only improves the yield, but also facilitates the implementation of the mounting process. By adopting the optical fiber adapter set, the assembly tolerance can be effectively compensated by utilizing the flexibility of the optical fiber, the stress is eliminated, and the problem of light loss of the assembly stress is avoided.