Light-emitting device bonding via segmented metal patterns
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Solution Overview
Problem
Existing manufacturing methods for light-emitting devices face challenges in suppressing stray bonding material, which affects the reliability of the apparatus.
Innovation Solution
A manufacturing method for a light-emitting device that includes a mounting substrate with specific metal patterns and a sealing member with a wider metal pattern, where the sealing member is joined to the mounting substrate using a bonding material, ensuring stable and complete coverage of the bonding material without protrusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a bonding material is applied to join the substrate and lid, then the joining strength is improved, but stray bonding material may protrude and affect reliability
Solution Approach 1:
The patent divides the bonding region into multiple metal patterns (first, second, and third metal patterns) arranged in specific positions. The bonding material is applied to these segmented patterns rather than a continuous surface, which confines the bonding material and prevents it from protruding outward, thus resolving the contradiction between achieving strong joining and preventing stray bonding material that would harm reliability.
Solution Approach 2:
The patent introduces a fourth metal pattern on the sealing member that acts as an intermediary to receive and contain the bonding material. This fourth metal pattern, with width greater than or equal to the first metal pattern, serves as a mediator that captures the bonding material within the joining region, preventing it from becoming stray material while maintaining strong bonding.
2Reliability
If the sealing member width is increased to cover the bonding material, then stray bonding material is suppressed, but the device size increases
Solution Approach 1:
The patent applies local quality by making the fourth metal pattern's width specifically greater than or equal to the first metal pattern's width only at the critical bonding region, rather than increasing the entire sealing member size. This localized dimensional adjustment is sufficient to contain the bonding material and prevent stray bonding, thus improving reliability without unnecessarily increasing overall device size.
3Manufacturing precision
If multiple metal patterns are arranged on the mounting substrate, then bonding material control is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent makes the fourth metal pattern on the sealing member universal by giving it a width greater than or equal to the first metal pattern, allowing it to serve multiple functions: providing a bonding surface, containing the bonding material, and preventing stray bonding. This multi-functionality simplifies the overall structure compared to having separate components for each function, thus improving bonding material control without proportionally increasing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively suppresses stray bonding material, enhancing the reliability and stability of the light-emitting device by ensuring proper joining and preventing unnecessary metal pattern formation.
Implementation Method 1
joining a sealing member to at least the first metal pattern of the mounting substrate via the bonding material
Data Source
AI summary
A manufacturing method of a light-emitting device includes: preparing a mounting substrate having a mounting surface, the mounting substrate including a first metal pattern arranged on a mounting surface side, a second metal pattern arranged on the mounting surface side inward of the first metal pattern in a plan view, and a third metal pattern arranged on the mounting surface side outward of the first metal pattern in the plan view; arranging a light-emitting element over the mounting surface of the mounting substrate; applying a bonding material to the first metal pattern; and joining a sealing member to at least the first metal pattern of the mounting substrate via the bonding material, the sealing member including a fourth metal pattern with a width greater than or equal to a width of the first metal pattern.