Light-emitting Component with Recessed Reflective Layer
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Solution Overview
Problem
Optoelectronic packages with light-emitting semiconductor chips face efficiency losses due to light absorption at sidewalls and mounting surfaces, and existing methods are not cost-efficient for producing high-efficiency light-emitting components.
Innovation Solution
A light-emitting component design featuring a carrier with a recessed reflective layer that prevents the reflective material from covering the mounting surface, ensuring light is redirected forward and maintaining mechanical stability, combined with a method for producing multiple components using a common carrier and encapsulation layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a reflective layer is applied to the carrier surface to redirect light forward, then light efficiency is improved, but the reflective material may cover the mounting surface and cause mechanical instability or electrical contact issues
Solution Approach 1:
The carrier surface is segmented into distinct functional zones: a mounting surface area free of reflective material for securing the light-emitting chip, and surrounding edge regions with reflective layers for light redirection. This spatial segmentation prevents the reflective material from covering the mounting surface while still achieving efficient light management across the carrier structure.
Solution Approach 2:
The reflective layer is applied selectively to specific regions of the carrier - specifically the edge regions surrounding the mounting surface - rather than uniformly across the entire surface. This local application ensures that the mounting surface maintains its original properties for mechanical stability and electrical contact, while the reflective edges provide optimized light redirection performance.
2Loss of energy
If the mounting surface area is reduced to allow more reflective material, then light efficiency is improved, but the area available for electrical contact and mechanical mounting is reduced
Solution Approach 1:
The carrier surface is divided into functionally distinct zones: a central mounting surface area reserved for electrical contact and mechanical mounting of the light-emitting chip, and peripheral edge regions dedicated to reflective light redirection. This segmentation allows both functions to operate optimally without competing for the same surface area.
Solution Approach 2:
The reflective function is transitioned from a two-dimensional surface coverage approach to a perimeter-based approach, where the reflective layer is concentrated at the edges and boundaries of the carrier rather than spreading across the central mounting area. This dimensional repositioning maximizes light redirection efficiency while preserving the mounting surface integrity.
3Ease of manufacture
If a common carrier and encapsulation layer are used for producing multiple components, then production cost is reduced, but the complexity of ensuring consistent quality across all components increases
Solution Approach 1:
The carrier and encapsulation layer are designed as universal components that can accommodate multiple light-emitting chips with identical or varying configurations. The standardized carrier structure with defined mounting surfaces and reflective edge regions enables consistent manufacturing processes across batches, ensuring quality uniformity while reducing per-unit production costs through economies of scale.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the overall efficiency of light-emitting components by preventing light absorption at the mounting surface and allowing for cost-effective production of high-efficiency light-emitting components with improved reflectivity and mechanical stability.
Implementation Method 1
the reflective layer is kept away from the mounting surface... light is redirected forward and maintaining mechanical stability
Data Source
AI summary
A light-emitting component is provided which comprises a carrier, a reflective layer and a light source, wherein the light source is mechanically fixed on a mounting surface of the carrier. The carrier has an electrically isolating basic body comprising an edge region, said edge region bounding the mounting surface. The edge region comprises a recess, wherein the reflective layer covers a base surface of the recess. Moreover, the mounting surface is vertically elevated with respect to the base surface of the recess at least in places, such that the reflective layer is kept away from the mounting surface.Furthermore, a method for producing such a light-emitting component is provided.