Light Emitting Device Heat Radiation Frame and Aspheric Lens

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Solution Overview

Problem

Conventional light emitting devices face issues with current accumulation and heat management, leading to reduced light extraction efficiency and reliability, particularly in large-area light emitting chips.

Innovation Solution

The design incorporates a substrate with lead electrodes and heat radiation frames arranged in specific configurations, including an aspheric optical lens and a reflective member, to improve heat dissipation and light orientation, while reducing electrode pattern effects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If a large-area light emitting chip is used, then light output is improved, but current accumulation and heat management issues worsen

Engineering Contradiction:
Improvelight outputVSAvoidcurrent accumulation and heat management
Core Design Contradiction:
Illumination intensityVSReliability

Solution Approach 1:

The light emitting chip is divided into multiple chip units, each with its own electrode connections. This segmentation reduces current accumulation in single large electrodes and improves heat distribution across multiple smaller contact points, while maintaining high light output through the combined area of multiple chips.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the substrate are assigned different functions: central regions accommodate light emitting chips for high light output, while peripheral regions contain lead electrodes and heat radiation frames for current distribution and thermal management. This local differentiation resolves the contradiction between light output and heat management.

Inventive Principle:
Principle #3Local quality

2Reliability

If lead electrodes are arranged closer to the light emitting chip, then electrical connection is improved, but heat dissipation capability deteriorates

Engineering Contradiction:
Improveelectrical connectionVSAvoidheat dissipation
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The electrode arrangement utilizes three-dimensional space by extending lead electrodes in multiple directions (first and second axis directions) and stacking heat radiation frames at different levels. This dimensional approach allows electrical connections to be optimized in the plane while heat dissipation occurs through vertical and radial pathways, resolving the spatial conflict between connection and cooling.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Illumination intensity

If conventional spherical lenses are used, then light extraction is improved, but light orientation control deteriorates

Engineering Contradiction:
Improvelight extractionVSAvoidlight orientation control
Core Design Contradiction:
Illumination intensityVSEase of operation

Solution Approach 1:

The patent employs aspheric lenses with specifically designed curved surfaces that deviate from spherical symmetry. These aspheric surfaces provide both high light extraction efficiency and precise control over light orientation angles, eliminating the trade-off between extraction and directional control by optimizing the curvature profile.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances light extraction efficiency, improves the reliability of the light emitting device by effectively managing heat and current distribution, and enhances light orientation angles.

Implementation Method 1

an aspheric optical lens and a reflective member, to improve heat dissipation and light orientation

Methodology Applied
Scientific EffectLight refraction and focusing: Lens

Implementation Method 2

a reflective member is disposed around a light emitting chip

Methodology Applied
Scientific EffectLight reflection: Reflection

Implementation Method 3

a heat radiation frame and a plurality of lead frames which are arranged in a second axis direction under the body

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10381537B2Light emitting device and lighting device having same
Publication Date: 2019.08.13 SUZHOU LEKIN SEMICON CO LTD
  • US10381537B2 patent drawing
  • US10381537B2 patent drawing
  • US10381537B2 patent drawing

AI summary

A light-emitting element disclosed according to an embodiment may comprise: a substrate comprising a body, a plurality of lead electrodes arranged over the body in a first axial direction, and a heat-radiating frame and a plurality of lead frames arranged below the body in a second axial direction; and a light-emitting chip arranged on a first lead electrode, which is arranged in the central area of the body among the plurality of lead electrodes, and electrically connected with the plurality of lead electrodes. The plurality of lead electrodes have a large length in the second axial direction, the heat-radiating frame is arranged in the central area below the body, and the heat-radiating frame and the plurality of lead frames have a large length in the first axial direction and may vertically overlap with the plurality of lead electrodes.