Light-emitting Device Convex Sealing Substrate Heat Dissipation
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Solution Overview
Problem
Existing light-emitting devices with organic electroluminescent elements face challenges in achieving efficient heat dissipation due to poor heat conduction from the organic EL element to the sealing substrate, particularly when using high-viscosity materials for the heat conducting member, which makes it difficult to form a thin film thickness.
Innovation Solution
A light-emitting device design featuring a sealing substrate with convex portions protruding towards the organic EL element, where the heat conducting member is placed between the convex portion and the organic EL element, utilizing high thermal conductivity fillers like aluminum oxide or silver, and applying pressure to achieve a thin film thickness of the heat conducting member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat conducting member with high viscosity material is used, then thermal conductivity is improved, but film thickness cannot be reduced to a thin level
Solution Approach 1:
The invention divides the sealing substrate into multiple regions: a first sealing region that contacts the heat conducting member and a second sealing region that is separated from it. This segmentation allows the heat conducting member to be positioned only in the first region, enabling thin film formation while maintaining effective heat dissipation path.
Solution Approach 2:
The invention applies different sealing configurations to different regions of the sealing substrate. The first sealing region has direct contact with the heat conducting member for efficient heat transfer, while the second sealing region is separated to accommodate the protruding structure. This local differentiation optimizes both heat dissipation and film thickness control.
2Temperature
If pressure is applied to reduce heat conducting member thickness, then heat conduction is improved, but high viscosity materials resist thinning
Solution Approach 1:
By segmenting the sealing substrate into first and second sealing regions, the invention creates a localized contact area that concentrates pressure effectively on the heat conducting member in the first region, enabling thinning without requiring excessive overall pressure that would be resistant to high viscosity materials.
Solution Approach 2:
The protruding structure of the sealing substrate acts as an intermediary that transmits and concentrates pressure onto the heat conducting member. This intermediary mechanism facilitates thin film formation by distributing the pressure application more effectively, overcoming the resistance of high viscosity materials.
3Reliability
If the gap between organic EL element and sealing substrate is filled with gas or vacuum, then sealing is achieved, but heat conduction becomes poor
Solution Approach 1:
The invention introduces a heat conducting member as an intermediary substance between the organic EL element and the sealing substrate. This mediator replaces the gas or vacuum in the gap, maintaining the sealing function while providing a thermal conduction path. The heat conducting member has both sealing properties and high thermal conductivity, simultaneously addressing both requirements.
Solution Approach 2:
The invention uses a composite structure combining the heat conducting member with the sealing substrate. The heat conducting member is formulated as a composite material that integrates sealing functionality with thermal conduction capability, overcoming the limitation of using simple gas or vacuum fills that provide sealing but poor heat conduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation by increasing the stress per unit area on the convex portion, allowing for a thinner heat conducting member and improved thermal conductivity, resulting in a light-emitting device with high heat dissipation characteristics.
Implementation Method 1
heat conduction from the organic EL element to the sealing substrate
Implementation Method 2
stress per unit area applied on the surface of the convex portion becomes high
Data Source
Figure 1~2
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Figure 5~6
AI summary
It is an object of the present invention to provide a light-emitting device having a composition capable of reducing a film thickness of a heat conducting member. The present invention provides a light-emitting device including: a supporting substrate; an organic electroluminescent element disposed on the supporting substrate; a sealing substrate for sealing the organic electroluminescent element, having a convex portion protruding toward the organic electroluminescent element; and a heat conducting member that is provided between the organic electroluminescent element and the convex portion, in which the organic electroluminescent element and the convex portion are attached through the heat conducting member, and in which a part or whole of the convex portion is overlapped with the organic electroluminescent element, and an area of an overlapped region of the convex portion and the organic electroluminescent element is smaller than an area of the organic electroluminescent element, as viewed from a thickness direction of the supporting substrate.